Exposure and Hole Forming Thinning Embedded Circuit Roll Manufacturing Method

Abstract

The invention discloses a roll-type manufacturing method of an exposed hole-forming thinned embedded circuit, which comprises the following steps: forming a first circuit layer on the surface of a second copper foil layer of a composite copper foil; forming a first circuit layer on the second copper foil The surface of the layer is covered with a first photosensitive layer; a blind hole connecting the surface of the first photosensitive layer and the surface of the first circuit layer is formed, and a conductive material layer is formed on the surface of the first photosensitive layer and the surface in each blind hole; Form a second circuit layer on the surface of the conductive material layer and in the blind hole; etch and remove the second copper foil layer and the conductive material layer not covered by the second circuit layer; because the method of the present invention is roll-to-roll In this way, the manufacturing efficiency is improved, and the first circuit layer is buried in the first photosensitive layer, thus avoiding damage or disconnection of the first circuit layer, and improving the circuit manufacturing yield.

Description

technical field [0001] A circuit manufacturing method, especially a roll-type manufacturing method for exposing holes and thinning embedded circuits. Background technique [0002] Consumer electronics products are one of the important trends in the development of the technology industry over the years. The demand for various smart phones, tablet computers, monitors and other products has rapidly increased with the penetration rate. Consumers not only have higher requirements for product quality, but also more The main fashion trend is thin, short and easy to carry. Therefore, manufacturers must continuously improve and improve the manufacturing efficiency, fineness and product yield of circuits. The existing circuit manufacturing method generally includes the following steps: take a substrate with a copper foil layer on the surface; cover a photoresist layer on the surface of the copper foil layer; perform exposure and development on the photoresist layer , to pattern the ...

AI Technical Summary

Problems solved by technology

[0003] The above-mentioned existing circuit manufacturing method uses a single-piece substrate, and each step is to move the substrate to the operation machine that performs each step by an automated machine. The moving process is time-consuming, resulting in a decrease in efficiency and easy to cause material damage.

Further, since the circuit layer is a precise circuit, the circuit layer is formed on the surface of the substrate and protrudes from the surface of the substrate after removing the circuit mask of the photoresist layer, which may be affected by subsequent processes. Affected and disconnected, resulting in lower yield

Therefore, the existing circuit manufacturing method must be further improved

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