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Silver powder for low-temperature curing conductive silver paste and preparation method thereof

A technology for conductive silver paste and silver powder, which is applied in metal processing equipment, transportation and packaging, etc., can solve the problems of inability to meet the performance requirements of low-temperature cured conductive silver paste for silver powder, low tap density, and wide particle size distribution, and achieves a reduction in Cleaning difficulty, high tap density and good thixotropy

Inactive Publication Date: 2019-11-12
北京氦舶科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the best silver powder preparation technology is monopolized by foreign manufacturers. Although domestic development has achieved certain results in recent years, there are widespread problems of wide particle size distribution, poor dispersion, and low tap density, which cannot meet the requirements of low-temperature curing conductive silver. Performance requirements of paste on silver powder

Method used

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  • Silver powder for low-temperature curing conductive silver paste and preparation method thereof

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preparation example Construction

[0027] The preparation method of silver powder for low-temperature curing conductive silver paste of the present invention specifically comprises the steps of: chemical reduction, ball milling, wherein:

[0028] The chemical reduction process includes: mixing the reducing agent solution and the silver salt solution for reaction, and controlling the pH of the system at 1-4, 4-7, and 7-14 sequentially through a pH adjusting solution; standing for sedimentation, washing, and obtaining a silver powder slurry ;

[0029] The ball milling process includes: adding ball milling solvent, lubricant, surfactant, ball milling medium and the above-mentioned silver powder slurry into ball milling equipment, ball milling, separating, filtering, drying, and sieving to obtain silver powder with high tap density; wherein, the surface active The agent contains amino and hydroxyl functional groups.

[0030] Preferably, during the chemical reduction process, the reaction process includes: adding t...

Embodiment 1

[0049] 1. Weigh 0.25kg of silver nitrate and dissolve it in 5L deionized water to make a silver salt solution; weigh 0.05kg of sodium carbonate or nitric acid and dissolve it in 0.5L of deionized water to make a pH adjustment solution; weigh 0.3kg of sodium phosphite Dissolve in 0.3L deionized water to make reducing agent solution.

[0050] 2. At 20°C, within 60 minutes, add the reducing agent solution into the silver salt solution by constant flow titration, and continue the reaction for 10 minutes; during the entire reaction process, control the pH of the system at 1-4 within the time period of 0-21 minutes, The pH of the system is controlled at 4-7 within the period of 22-63 minutes, and the pH of the system is controlled at 7-14 in the period of 64-70 minutes.

[0051] 3. Set aside to settle, after the powder settles, pour off the supernatant, wash with deionized water until the conductivity of the supernatant is less than 20μs / cm, and obtain a silver powder slurry;

[00...

Embodiment 2

[0054] 1. Weigh 1.25kg silver nitrate and dissolve in 5L deionized water to make a silver salt solution; weigh 0.2kg sodium hydroxide or nitric acid and dissolve it in 0.5L deionized water to make a pH adjustment solution; weigh 0.6kg tripropylene Dissolve triol in 0.3L deionized water to make reducing agent solution.

[0055] 2. At 50°C, within 120 minutes, add the reducing agent solution into the silver salt solution by constant flow titration, and continue to react for 30 minutes; during the whole reaction process, control the pH of the system at 1-4 within the time period of 0-60 minutes, The pH of the system is controlled at 4-7 within the period of 61-135 minutes, and the pH of the system is controlled at 7-14 in the period of 136-150 minutes.

[0056] 3. Set aside to settle, after the powder settles, pour off the supernatant, wash with deionized water until the conductivity of the supernatant is less than 20μs / cm, and obtain a silver powder slurry;

[0057] 4. Stir and...

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Abstract

The invention particularly relates to silver powder for low-temperature curing conductive silver paste and a preparation method thereof. The method specifically comprises steps of chemical reduction and ball-milling, wherein the chemical reduction process comprises the following steps of mixing a reducing agent solution with a silver salt solution for reaction, and controlling the pH scale within1-4, 4-7 and 7-14 in sequence through a pH adjusting solution; and leaving the mixture static for sedimentation, and then washing the mixture to obtain silver power paste liquid. The ball-milling process comprises the following steps of adding a ball milling solvent, a lubricant, a surface active agent, a ball milling medium and the silver power paste liquid into a ball-milling device, and then carrying out ball milling, separating, filtering, drying and screening to obtain high-tap-density silver powder, wherein the surface active agent contains amino and hydroxyl functional groups. The silver powder prepared by the method has characteristics of controllable size, uniform particle size, good dispersibility, high tap density and the like, and meanwhile the method is simple in preparation process, convenient to operate, and easy to industrialize.

Description

technical field [0001] The invention belongs to metal powder for electronic industry, in particular to a silver powder for low-temperature curing conductive silver paste and a preparation method thereof. Background technique [0002] Conductive silver paste is one of the most important materials in the electronics industry, and is widely used in the coating of printed circuits and the bonding of electronic devices. Low-temperature silver paste generally refers to the silver paste whose curing temperature is lower than 200°C during the application process. With the change of the application substrate and the control of production costs, most low-temperature silver pastes are required to have a curing temperature lower than 150°C. In order to balance the electrical properties and cost factors of the silver paste, the resin ratio and silver content of the low-temperature silver paste are decreasing. These changes put forward more requirements for the silver powder, including th...

Claims

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Application Information

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IPC IPC(8): B22F9/24B22F9/04B22F1/00
CPCB22F9/24B22F9/04B22F2009/245B22F2009/043B22F2009/042B22F1/068B22F1/052B22F1/065B22F1/10
Inventor 商海赵刚郎嘉良黄翟
Owner 北京氦舶科技有限责任公司