High vacuum interconnection system for nano-powder preparation and in-situ ultra-high pressure forming
A nano-powder, interconnected system technology, applied in nanotechnology for materials and surface science, preparation of test samples, nanotechnology, etc., to achieve the effects of improving operational efficiency, avoiding pollution, and compact structural design
Active Publication Date: 2022-04-01
NANJING UNIV OF SCI & TECH
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Problems solved by technology
Both the sample transfer and the second pressing process can only be carried out in an atmospheric environment, so the oxidation or other effects of the atmosphere on the non-dense samples cannot be avoided during this period
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[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0026] figure 1 The structure of the high vacuum interconnection system of the present invention is shown. Such as figure 1 The high-vacuum interconnection system that can realize nano-powder preparation and in-situ ultra-high pressure molding is shown, including powder-making chamber 1, pressure chamber 2, pressure chamber 3, sample transfer chamber 4, vacuum interconnection pipeline 5, and a set of transfer rods 6. A set of vacuum pumping device7. Among them, the powder-making chamber 1 , the first pressure chamber 2 , the second pressure chamber 3 , and the sample transfer chamber 4 are directly sealed and fixedly connected to each chamber through a vacuum interconnection pipeline 5 . A plurality of transmission rods 6 are respectively facing the milling chamber 1 , the first pressure chamber 2 , the second pressure chamber 3 , and the s...
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Abstract
The invention discloses a high-vacuum interconnection device for realizing nano-powder preparation and in-situ ultra-high pressure molding, including a sample transfer chamber, a powder-making chamber, a pressure chamber, a pressure chamber, a vacuum interconnection pipeline, and a vacuuming device system. Multiple transfer rods, as well as powder collection and sample transfer devices. The system can use a vacuum device to evacuate each chamber to a high vacuum state, collect nano-powder in the powder-making chamber through the powder collection device, transfer the powder to the pressure chamber through the transfer rod and press it into a thin sheet, and then transfer the powder through the sample transfer device. The flakes are sent to the second pressure chamber for ultra-high pressure forming. The invention realizes the in-situ ultra-high pressure compression molding of the nano powder under high vacuum conditions, and avoids the problems of various pollution and oxidation of the nano powder in the traditional compression molding process.
Description
technical field [0001] The invention relates to the field of nanostructure material preparation systems, in particular to a high-vacuum interconnection system capable of realizing nano-powder preparation and in-situ ultra-high-pressure molding, and realizing in-situ ultra-high-pressure molding of nano-powder in a high-vacuum environment. Background technique [0002] The concept of nanostructured materials was first proposed by German scientist Professor H. Gleiter in the 1980s. The basic idea is that when the particle size of the material is reduced to the nanometer level, the ratio of the number of atoms on the surface to the number of atoms inside the particle will increase sharply. Since the characteristics of the surface atoms are different from those of the internal atoms, when these nanoparticles When pressed into bulk (known as nanostructured materials), the properties of the material change dramatically. For example, nano-copper has super-ductility, and nano-cerami...
Claims
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IPC IPC(8): G01N1/28B82Y40/00B82Y30/00
CPCG01N1/286B82Y40/00B82Y30/00
Inventor 冯涛余洲佟喆赫伯特·格莱特霍斯特·哈恩默罕默德·加法里
Owner NANJING UNIV OF SCI & TECH