Wafer edge finding device and method for intelligent distance measurement
An intelligent ranging and edge-finding technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as lowering the machine’s proper rate and wafer downtime, so as to improve the productivity of the production line and reduce the production cost Effect
Active Publication Date: 2019-11-15
福建省福联集成电路有限公司
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Problems solved by technology
[0003] For this reason, it is necessary to provide an intelligent range-finding wafer edge-finding device to solve the problem that the wafer notch corner edge-finding device in the prior art has an abnormal problem in the edge-finding device, causing the wafer to hang at the edge-finding device, reducing machine failure. The problem of the correctness rate of the station
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[0028] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.
[0029] see figure 1 , in this embodiment, a specific implementation of a wafer edge detection device for intelligent distance measurement is as follows:
[0030] A wafer edge-finding device for intelligent distance measurement, comprising: a stage 1, an edge-finding device base 2, a rotating arm 3, an infrared sensor 4, a servo motor infrared ranging arm 5, and an infrared ranging sensor 6; The edge device base 2 is connected to the carrier 1; the rotating arm 3 is fixedly arranged on the edge finding device base 2, and the rotating arm 3 is arranged above the carrier 1; the carrier 1 is used for storing The object to be measured; the infrared sensor 4 is arranged on the rotating arm 3, and the infrared sensor 4 is used for: position...
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The invention relates to the technical field of wafer edge finding, in particular to a wafer edge finding device and method for intelligent distance measurement. The wafer edge finding device for intelligent distance measurement comprises a stage, an edge finding device base, a rotating arm, an infrared sensor, a servo motor infrared distance measurement arm and an infrared distance measurement sensor, wherein the edge finding device base is connected with the stage; the rotating arm is arranged above the stage; the infrared sensor is arranged on the rotating arm; the servo motor infrared distance measurement arm is arranged on the rotating arm; the infrared distance measurement sensor is arranged on the servo motor infrared distance measurement arm; and the infrared distance measurement sensor is used for measuring the distance L between a to-be-measured object and the servo motor infrared distance measurement arm and measuring the distance X between the edge of the to-be-measured object and the infrared distance measurement sensor. Through the device, the notch angle of a wafer can be subjected to quick and effective edge finding, and even if the edge finding is abnormal, the problem of reducing the proper rate of a stock does not exist, the production cost is reduced, and the productivity of a production line is improved.
Description
technical field [0001] The invention relates to the technical field of wafer edge detection, in particular to a wafer edge detection device and method for intelligent distance measurement. Background technique [0002] After the metal evaporation process is completed, some metal will remain and cover the notch corner of the wafer, and it is easy to cause abnormal edge detection of the wafer when performing edge detection at the notch corner. However, in the existing edge-finding device, when there is an abnormal edge-finding problem, it will cause abnormal transmission, causing the wafer to hang at the edge-finding device, thereby reducing the correct rate of the machine. And when the notch corner cannot be found, it is necessary to take out the wafer and replace the wafer, which is easy to drop and touch the wafer surface, causing damage to the wafer film surface, thereby causing cost loss and reducing production efficiency. Contents of the invention [0003] For this re...
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IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/67259
Inventor 吴淑芳陈智广李立中黄光伟马跃辉吴靖庄永淳林伟铭
Owner 福建省福联集成电路有限公司