Dust-free processing technique for chip silicon production

Abstract

The invention discloses a dust-free processing technique for chip silicon production, which includes the following processing steps: a, crystal pulling: placing raw materials in a crucible, putting aseed crystal on the surface of a melted object after the raw materials are completely dissolved, and performing a crystal pulling operation until a monocrystalline silicon ingot having a larger diameter than a final wafer is pulled out; b, the preliminary processing of the monocrystalline silicon ingot; c, wafer slicing; d, wafer dust-free fine processing; e, etching and cleaning; f, wafer polishing and cleaning; and g, quality inspection. The processing technique has beneficial effects that negative-pressure dust collection is performed on a polished part through corner polishing and surfacepolishing steps in a wafer processing procedure so as to reduce and eliminate dust generated during the wafer processing, thereby achieving dust-free processing during the chip silicon production process, reducing the adverse effects of dust on equipment operation during the processing, eliminating the influence of dust adhesion on the surface of the wafer during wafer processing, and improving wafer processing quality.

Description

technical field [0001] The invention relates to the technical field of chip silicon processing, in particular to a dust-free processing technology for chip silicon production. Background technique [0002] Chip silicon refers to the processed semiconductor silicon wafer, which is the basic material for making integrated circuits and discrete devices. The production of chip silicon needs to go through steps such as crystal pulling, generation of single crystal silicon ingots, wafer slicing, wafer processing, etching and polishing, among which a large amount of dust will be generated during wafer processing, especially during wafer processing During the corner grinding and grinding process, the dust generated falls on the grinding equipment and the wafer. During the grinding and grinding process, it will hinder the processing to a certain extent and reduce the processing quality of the wafer. When processing circuits, the dust on the surface of the wafer will have a great adv...

AI Technical Summary

Problems solved by technology

The production of chip silicon needs to go through steps such as crystal pulling, generation of single crystal silicon ingots, wafer slicing, wafer processing, etching and polishing, among which a large amount of dust will be generated during wafer processing, especially during wafer processing During the corner grinding and grinding process, the dust generated falls on the grinding equipment and the wafer. During the grinding and grinding process, it will hinder the processing to a certain extent and reduce the processing quality of the wafer.