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A mechanical test fixture and clamping method for 3D integrated microsystem components

A technology of mechanical testing and components, applied in the direction of workpiece clamping devices, manufacturing tools, etc., can solve problems such as inability to apply 3D integrated microsystem devices

Active Publication Date: 2021-04-23
NO 24 RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This non-traditional shape structure makes the existing clamping methods and fixtures for mechanical testing unsuitable for this type of 3D integrated microsystem device

Method used

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  • A mechanical test fixture and clamping method for 3D integrated microsystem components
  • A mechanical test fixture and clamping method for 3D integrated microsystem components
  • A mechanical test fixture and clamping method for 3D integrated microsystem components

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Embodiment Construction

[0046] As mentioned above in the background technology, due to the difference in its design concept, process technology and functions, the 3D integrated microsystem is different from the traditional components in terms of physical structure, package shell and material, etc., resulting in The environmental test requirements and methods of the two are different, for example: traditional PGA and BGA components only require Y 1 Direction High Acceleration Centrifugal Test, Y 1 Directional impact test and vibration test, while 3D integrated microsystem needs to carry out Y 1 , Y 2 , or even high-acceleration centrifugal tests in more directions, impact tests and vibration tests in X, Y, and Z directions; at present, there are mature traditional PGA and BGA component mechanical test clamping methods and test fixtures, but due to different processes and test requirements At present, there is a lack of feasible clamping methods and applicable test fixtures for mechanical testing of ...

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Abstract

The invention provides a mechanical test fixture and clamping method for 3D integrated microsystem components. In the fixture, the side surfaces of the components to be tested are squeezed and clamped through the clamping holes of the sub-fixtures, and the upper and lower surfaces can be clamped effectively. The uneven 3D integrated micro-system components solve the problem that such devices cannot be clamped; after the sub-fixture clamps the components to be tested, cooperate with the locking and fixing of the sub-fixtures by the mother fixture, the components to be tested can be fixed All degrees of freedom are completely locked, and it only needs to be clamped once for the test components to be universally used in various mechanical tests such as high-acceleration centrifugation (>5000g), vibration, and impact in multiple test directions, reducing the number of times in different mechanical tests , Repeated clamping quality hidden dangers, and improve the efficiency of mechanical testing; In addition, for components to be tested with different dimensions, design a variety of sub-fixtures with different shapes and sizes of clamping holes to achieve the fixture for different Common use of components to be tested reduces test costs.

Description

technical field [0001] The invention relates to the technical field of mechanical environmental testing, in particular to a mechanical testing fixture and a clamping method for 3D integrated microsystem components. Background technique [0002] Environmental testing is a test technology for assessing product quality and reliability. It aims to eliminate defective and unqualified products and ensure that their quality and reliability meet the actual use requirements. As an important part of environmental testing, mechanical tests such as high-acceleration centrifugation, vibration, and impact are aimed at determining the adaptability of products to mechanical environments and evaluating their structural stability and integrity. Screening and other essential test items. [0003] With the development of electronic packaging technology, 3D integrated microsystems have emerged. 3D integrated microsystems integrate five basic elements of microelectronics, optoelectronics, MEMS, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B25B11/00
CPCB25B11/00
Inventor 朱朝轩罗俊吴兆希谭骁洪李晓红秦国林张锋唐毅
Owner NO 24 RES INST OF CETC
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