Packaging method and packaging structure of integrated antenna
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology of integrated antenna and packaging method, which is applied in the direction of antenna support/mounting device, antenna grounding switch structure connection, antenna, etc., can solve the problems of integrated antenna preparation precision limitation, achieve the goal of reducing size and improving placement accuracy Effect
Active Publication Date: 2019-12-03
江苏中科智芯集成科技有限公司
View PDF6 Cites 4 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0004] Therefore, the technical problem to be solved by the present invention is to solve the problem that there are many limi
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Example Embodiment
[0034] Example 1
[0035] This embodiment provides a packaging method for an integrated antenna, such as figure 1 shown, including the following steps:
[0036] Step S101: preparing an integrated antenna layer on a carrier.
[0037] here, as figure 2 As shown, the integrated antenna layer 2 includes an antenna 21 and a dielectric layer 22 covering the antenna 21 , and the interface of the antenna 21 is exposed outside the dielectric layer 22 .
[0038] Here, in order to remove the carrier 1 after performing all the steps of the method in the embodiment of the present invention and completing the preparation of the package structure of the integrated chip 3, as figure 2 As shown, a sacrificial layer 11 can be provided on the carrier 1 first, and then the integrated antenna layer 2 can be prepared on the sacrificial layer 11. Specifically, the sacrificial layer 11 can be an adhesive layer, for example, a high temperature bonding adhesive layer or a UV adhesive film Wait. ...
Example Embodiment
[0088] Example 2
[0089] This embodiment provides a wafer-level fan-out packaging structure, which is prepared according to the above-mentioned embodiment 1 and its preferred implementation manners, and what has been explained will not be repeated here.
[0090] The packaging structure of the integrated antenna provided in this embodiment, such as Figure 7 As shown, it includes: an integrated antenna layer 2, a chip 3, a package body 4 and conductive pillars.
[0091] Among them, the integrated antenna layer 2 includes an antenna 21 and a dielectric layer 22 covering the antenna 21, and the antenna interface of the antenna 21 is exposed outside the dielectric layer 22; the package body 4 is arranged on the integrated antenna layer 2, and the chip 3 is packaged in the package body 4 , the device surface of the chip 3 is away from the integrated antenna layer 2; the package body 4 also includes a number of conductive columns, the conductive columns include the first conductiv...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention discloses a packaging method and a packaging structure of an integrated antenna. The method comprises the following steps of: preparing an integrated antenna layer on a carrier, whereinthe integrated antenna layer comprises an antenna and a dielectric layer coating the antenna, and the interface of the antenna is exposed out of the dielectric layer; positively mounting a chip on theintegrated antenna layer, forming a packaging body on the integrated antenna layer, and packaging the chip; and forming a plurality of conductive columns in the packaging body, wherein the conductivecolumns comprise a first conductive column for electrically connecting the antenna interface to the upper surface of the packaging body and a second conductive column for electrically connecting thebonding pad of the chip to the upper surface of the packaging body. The integrated antenna layer is firstly prepared on the carrier, so that the preparation process of the antenna is not limited by preparation processes or preparation conditions brought by other structures, and the preparation of a high-precision and high-frequency antenna becomes possible; and the antenna and the chip are vertically integrated and packaged, so that a packaging structure with a relatively small size is finally obtained.
Description
technical field [0001] The invention relates to the technical field of packaging of semiconductor integrated circuits, in particular to a packaging method and a packaging structure for integrated packaging of a chip and an antenna. Background technique [0002] The packaging structure of 5G high-frequency communication chips needs to integrate the antenna, RF front-end and transceiver into a single system-in-package. The advantage of integrating the antenna into the chip package is that it can simplify the system design, which is conducive to miniaturization and low cost. At present, there are many integrated antenna technologies emerging in the industry, such as integrated antenna design research based on various technologies such as ceramics, organic framework, and fan-out packaging. Among them, for the integrated antenna technology based on fan-out packaging technology, for a single-chip system, since the conductive interconnection between the chip and the antenna does n...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more