A method for manufacturing a circuit board with a boss as a pad

Abstract

A method for making a circuit board with a boss as a pad, the steps are: material cutting, copper reduction; drilling; copper sinking; film pressing; exposure and development; line electroplating; film pressing; exposure and development; pad electroplating; stripping Film, copper stripping; pressing the insulating layer; grinding: grinding the surface of the insulating layer until the pad is exposed, and the top / bottom pad is opened to form a window. The invention adopts thermosetting insulating material, which is low in cost, does not require silk screen printing, and is environmentally friendly. At the same time, the manufacturing process is simple and easy to operate. The pads are directly produced by grinding, which is more conducive to the production of small-area, high-density pads, and the surface of the prepared circuit board Flat, good for precision packaging, and the circuit is firmly attached and of good quality.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and relates to a circuit board, in particular to a method for producing a circuit board with bosses as pads. Background technique [0002] With the continuous advancement of technology, the functional requirements of electronic products are getting higher and higher. During the preparation process of the circuit board, it is often necessary to make bosses as pads. The existing manufacturing methods are as follows: figure 1 As shown, the process is: cutting (substrate 10 blanking) → drilling 20 → copper sinking (depositing a layer of conductive copper layer 30 on the hole wall insulation layer) → copper plating (thickening the hole copper thickness and surface Copper thickness 300)→lamination (pressure-sensitive dry film 40)→exposure, development (remove the dry film 40 in the non-circuit area)→etching (remove the copper layer in the non-circuit area)→remove the film (remove the ...

AI Technical Summary

Problems solved by technology

[0004] 2. The photosensitive ink for solder resist needs to use screen printing, the solid waste of the ink needs to be treated, and the screen needs to be cleaned and disposed of, which is not environmentally friendly;

[0005] 3. The uniformity of the solder mask thickness of the screen printing process is poor, generally within ±10um, and the surface is uneven, and there will be unevenness;

[0006] 4. The copper surface after the window is opened is prone to residual ink during the ink development process, which leads to the inability to plate the surface of the pad in the subsequent surface treatment process;

[0007] 5. Side erosion is unavoidable on the edge of the window, and the thicker the ink, the greater the side erosion;

[0008] 6. The rigidity of the photosensitive ink material is low, and the glass temperature transition point is low, resulting in a high degree of thermal expansion of the product in the high-temperature process, which is not conducive to the high-precision packaging process;

[0009] 7. Due to the tolerance of solder mask exposure alignment, it is not conducive to the production of small-area and high-density pads

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