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Bonding method of MEMS wafer in MEMS packaging process

A wafer and bonding technology, applied in the direction of microstructure devices, processing microstructure devices, assembly microstructure devices, etc., can solve problems such as device failure, low efficiency of bonding technology, microstructure blockage in devices, etc., to ensure process , The method is simple, and the effect of ensuring consistency

Pending Publication Date: 2019-12-06
NAT INST CORP OF ADDITIVE MFG XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] The purpose of the present invention is to provide a method for bonding MEMS wafers in the MEMS packaging process. Problems such as microstructure clogging

Method used

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  • Bonding method of MEMS wafer in MEMS packaging process
  • Bonding method of MEMS wafer in MEMS packaging process
  • Bonding method of MEMS wafer in MEMS packaging process

Examples

Experimental program
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Effect test

Embodiment

[0052] This embodiment provides a method for bonding MEMS wafers in the MEMS packaging process, below in conjunction with the attached figure 1 A detailed description of the specific implementation steps:

[0053] Step 1: Prepare two MEMS wafers that need to be bonded, and set the first mark on the two MEMS wafers; figure 2 As shown, the first mark provided in the present embodiment is two first positioning holes 1, certainly also can be a plurality of positioning holes; In addition, in the present embodiment, the shape, length and width of the two MEMS wafers are exactly the same ( Since the length and width are exactly the same, the positions and sizes of the two first positioning holes on the two MEMS wafers are the same), and the microstructure patterns on the two MEMS wafers are different according to different requirements;

[0054] Step 2: preparation of a patterned mask;

[0055] Prepare a film sheet with the same shape and size as the MEMS crystal element, and pass...

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Abstract

The invention relates to a bonding method of an MEMS wafer in an MEMS packaging process, and solves the problems of low efficiency of an existing MEMS device packaging bonding technology, device failure caused by high-temperature and high-pressure conditions, microstructure blockage in a device caused by an adhesive film preparation method and the like. The method mainly comprises the following steps: 1, preparing two MEMS wafers to be bonded; 2, preparing a patterned mask; 3, preparing an adhesive; 4, preparing a bonding adhesive film; 5, bonding the two MEMS wafers; and 6, placing the two bonded MEMS wafers for heating and curing, so as to achieve bonding of the MEMS wafers.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a method for bonding MEMS wafers in the MEMS packaging process. Background technique [0002] MEMS (Micro Electro Mechanical Systems), that is, micro-electromechanical systems, is a micro-device or system that integrates micro-mechanisms, micro-sensors, micro-actuators, and signal processing and control circuits, up to interfaces, communications, and power supplies. Products based on MEMS technology, such as micro-actuators, micro-sensors, and micro-components, are increasingly common in aviation, aerospace, automotive, biomedicine, environmental monitoring, military and other fields, and have very strong market competitiveness. [0003] MEMS manufacturing and packaging technology basically follows the integrated circuit (IC) manufacturing technology, but on the one hand, the interaction signals between MEMS devices and the outside world are not limited to elec...

Claims

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Application Information

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IPC IPC(8): B81C3/00
CPCB81C3/001B81C2203/032
Inventor 王莉张浩黄菲卢秉恒
Owner NAT INST CORP OF ADDITIVE MFG XIAN
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