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Image sensor and manufacturing method thereof, chip and handheld device

A technology of image sensor and manufacturing method, which is applied in radiation control devices, measuring devices, instruments, etc., can solve problems such as inability to generate depth maps, and achieve the effect of improving accuracy

Inactive Publication Date: 2019-12-13
SHENZHEN GOODIX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Time-of-flight is the use of specially designed pixels to measure distances by measuring the time it takes for photons to fly and return, but current technology cannot produce depth maps with sufficient accuracy

Method used

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  • Image sensor and manufacturing method thereof, chip and handheld device
  • Image sensor and manufacturing method thereof, chip and handheld device
  • Image sensor and manufacturing method thereof, chip and handheld device

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Embodiment Construction

[0031] The following disclosure provides various implementations or examples, which can be used to implement different features of the present disclosure. Specific examples of components and arrangements are described below to simplify the disclosure. It is conceivable that these descriptions are only examples and are not intended to limit the content of the present invention. For example, in the description below, forming a first feature on or over a second feature may include some embodiments wherein the first and second features are in direct contact with each other; and may also include In some embodiments, additional components are formed between the first and second features, such that the first and second features may not be in direct contact. In addition, this disclosure may reuse reference symbols and / or labels in multiple embodiments. Such repetition is for the sake of brevity and clarity, and does not in itself represent a relationship between the different embodi...

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Abstract

This application discloses an image sensor (100 / 200 / 300 / 400 / 500), a method for manufacturing the same, a chip, and a handheld device using the chip. The image sensor includes a semiconductor substrate(108) and a plurality of pixels. Each of the plurality of pixels includes: a photosensitive sensor (106) disposed on the semiconductor substrate; a polarizing layer (104) disposed on the semiconductor substrate; and a microlens (102) disposed on the semiconductor substrate. The polarizing layer is located between the microlens and the semiconductor substrate. The application also discloses the chip, the handheld device and a manufacturing method of the image sensor.

Description

technical field [0001] The present application relates to an image sensor, a manufacturing method thereof, a chip and a handheld device using the chip, in particular to an image sensor with a polarizing layer, a manufacturing method of the image sensor, an image sensing chip and a handheld device. Background technique [0002] CMOS image sensors have been mass-produced and applied. Traditional image sensors can generate two-dimensional (2D) images and videos. Recently, image sensors and systems that can generate three-dimensional (3D) images have received widespread attention. These three-dimensional image sensors can be applied to face recognition, augmented reality (AR, AUgmented Reality ) / Virtual Reality (VR, Virtual Reality), drones, etc. [0003] Existing 3D image sensors mainly have three implementation methods: stereo binocular, structured light and time of flight (ToF, Time of Flight). [0004] Time-of-flight uses specially designed pixels to measure distances by m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146G01S17/08G06K9/20
CPCH01L27/14621H01L27/14643H01L27/14685H01L27/14689G01S17/08G06V40/16G06V10/147H01L27/14625H01L27/14627H01L27/14603H01L27/14645H01L27/1464G01S7/4816G01S17/89H01L27/14623
Inventor 杨孟达
Owner SHENZHEN GOODIX TECH CO LTD