A high-permeability high-frequency planar inductor and its preparation method
A planar inductance, high permeability technology, applied in the direction of inductance/transformer/magnet manufacturing, transformer/inductor components, transformer/inductor coil/winding/connection, etc., can solve unfavorable circuit integration and miniaturization, Occupy a large area, small inductance and other problems, to achieve the effect of excellent soft magnetic performance, light weight, high permeability
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[0032] The preparation method of the above-mentioned high-permeability and high-frequency planar inductor includes the following steps: (a) cleaning the dielectric substrate in an ultra-clean room; (b) adopting an ultraviolet exposure photolithography process, using photoresist as a mask, The surface of the substrate is etched with an array of inductance units and lobes; (c) depositing on the surface of the product in step (b) by magnetron sputtering to form a soft magnetic film layer; (d) immersing the product in step (c) into In the stripping liquid, stripping is performed to obtain the high-permeability high-frequency planar inductor formed on the surface of the dielectric substrate. In step (c), the magnetron sputtering process adopts high-vacuum magnetron sputtering equipment, and the deposition vacuum background is pumped to 1×10 -5 Below Pa, the target material is an iron target with a purity of 99.99%, and multiple Hf metal sheets are evenly placed on the surface of th...
Embodiment 1
[0036] This embodiment provides a high-permeability high-frequency planar inductor and its preparation method, such as figure 1 So, the details are as follows:
[0037] (a) Clean the substrate in the ultra-clean room (select different cleaning methods and processes according to the material of the substrate): 4-inch silicon wafer (the substrate size can be cut and customized according to requirements) is first ultrasonicated with acetone for 10 minutes, and then ultrasonicated with alcohol 10 minutes, finally ultrasonicated with deionized water for 10 minutes, and blown dry with nitrogen;
[0038] (b) The conventional UV exposure photolithography process is used for processing. The specific process flow is as follows: (1) Fix the cleaned substrate on the vacuum chuck of the KW-4A desktop glue homogenizer, and then spin coat the surface of the substrate RZJ-304 positive photoresist; coating speed is 3500rpm; coating time is 60s; photoresist thickness is 2μm; (2) pre-baking RZJ...
Embodiment 2
[0045] This embodiment provides a high-permeability, high-frequency planar inductor and its preparation method, which is basically the same as that in Embodiment 1, except that three 3×3×0.5mm iron targets are evenly placed on the surface of the iron target 3 The cube-shaped Hf metal sheet is determined by XSP or EDAX energy spectrometry: x is 0.7, y is 0.15, and Hf is 0.15. At this time, in the 0.5GHz frequency band, its magnetic permeability is about 220, the resonance frequency is 2.1GHz, and the Snoek product is 4.62×10 11 ,like Figure 4 shown.
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