Underlayer substrate and manufacturing method of array substrate
A substrate substrate and manufacturing method technology, applied in the direction of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., can solve the problems that the quality of flexible display panels needs to be improved, and achieve good interface flatness and flatness Good, avoid warping effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0022] The intermediate structure used to manufacture the array substrate includes a base substrate, the base substrate includes a substrate and a flexible base on the substrate, wherein the flexible base has a larger coefficient of thermal expansion (coefficient of thermal expansion, CTE) than the substrate.
[0023] Since the flexible substrate has a larger thermal expansion coefficient than the substrate, the temperature changes during the heating process of the array substrate, such as substrate baking (Baking), encapsulant curing (Curing), subsequent thermal cycle (Thermal Cycle) operations, etc. During the process, the deformation of the substrate is smaller than the deformation of the upper flexible substrate. Since the deformation of the substrate is smaller than that of the flexible substrate, during the thermal expansion of the substrate and the flexible substrate, the substrate will be warped and deformed.
[0024] Upward deformation of the substrate will affect the...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


