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Underlayer substrate and manufacturing method of array substrate

A substrate substrate and manufacturing method technology, applied in the direction of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., can solve the problems that the quality of flexible display panels needs to be improved, and achieve good interface flatness and flatness Good, avoid warping effect

Inactive Publication Date: 2020-01-10
KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The quality of flexible display panels made by existing technologies needs to be improved

Method used

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  • Underlayer substrate and manufacturing method of array substrate
  • Underlayer substrate and manufacturing method of array substrate
  • Underlayer substrate and manufacturing method of array substrate

Examples

Experimental program
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Embodiment Construction

[0022] The intermediate structure used to manufacture the array substrate includes a base substrate, the base substrate includes a substrate and a flexible base on the substrate, wherein the flexible base has a larger coefficient of thermal expansion (coefficient of thermal expansion, CTE) than the substrate.

[0023] Since the flexible substrate has a larger thermal expansion coefficient than the substrate, the temperature changes during the heating process of the array substrate, such as substrate baking (Baking), encapsulant curing (Curing), subsequent thermal cycle (Thermal Cycle) operations, etc. During the process, the deformation of the substrate is smaller than the deformation of the upper flexible substrate. Since the deformation of the substrate is smaller than that of the flexible substrate, during the thermal expansion of the substrate and the flexible substrate, the substrate will be warped and deformed.

[0024] Upward deformation of the substrate will affect the...

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Abstract

The embodiment of the invention relates to an underlayer substrate and a manufacturing method of an array substrate. The underlayer substrate comprises a substrate, a pretreatment layer located on thesubstrate and a flexible substrate, wherein the pretreatment layer is used for applying pressure stress to the substrate; and the flexible substrate and the substrate are respectively located on theopposite surfaces of the pretreatment layer. The problem of substrate warping in the manufacturing process of the underlayer substrate or the array substrate can be avoided, and thus the yield of theunderlayer substrate or the array substrate is improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a manufacturing method of a base substrate and an array substrate. Background technique [0002] In recent years, various new display technologies emerge in an endless stream, including 2D display technologies such as organic light-emitting diode display (OLED), electronic ink (E Ink), laser display (Laser display), light field display ( Light field display) and other 3D display technologies. [0003] At present, with the popularity of electronic devices and the demands of the public, flexible display panels have become the focus of research. Compared with traditional rigid display panels, flexible display panels have many advantages, including rollability, thinness, good durability, and good luminescence. [0004] The quality of the flexible display panels made in the prior art needs to be improved. Contents of the invention [0005] In order to solve the above tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/00H10K99/00
CPCH10K59/00H10K59/12H10K77/111Y02E10/549Y02P70/50
Inventor 许晓伟刘达
Owner KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT