Novel storage structure based on double-sided blind hole printed board process

Abstract

The invention discloses a novel storage structure based on a double-sided blind hole printed board process, which comprises an insulating printed circuit board and an FPGA arranged on one end surfaceof the insulating printed circuit board, wherein the insulating printed circuit board comprises an upper blind plate, a core plate and a lower blind plate which are arranged in sequence; a plurality of first memory bank units are uniformly arranged on one end surface, close to the FPGA, of the insulating printed circuit board; second memory bank units corresponding to the first memory bank units are uniformly arranged on the other end surface of the insulating printed circuit board; a first wiring layer and a second wiring layer are respectively arranged in the upper blind plate and the lowerblind plate; each flat cable end of the first memory bank unit and each flat cable end of the second memory bank unit are respectively and fixedly connected with corresponding electric connection nodes of the first wiring layer and the second wiring layer; first through hole strips penetrating through the whole insulating printed circuit board are arranged at the two ends of the insulating printedcircuit board respectively, and one set is arranged below the FPGA.

Description

technical field [0001] The invention relates to the field of computer storage hardware, in particular to a novel storage structure based on double-sided blind-hole printed board technology. Background technique [0002] With the advent of the big data era, the demand for data storage has ushered in explosive growth. In China, the rapid development of the semiconductor industry's dependence on memory has seriously affected the country's high-tech development. Chinese governments at all levels have recently invested hundreds of billions of dollars in the memory field, which has already opened the clarion call to conquer the great battle of memory. [0003] At present, memory, as an important part of computer architecture, has a decisive impact on system-wide performance indicators, integration scale and stable operation. In order to obtain the advantages of high efficiency, flexibility, compactness, and SI characteristics that memory modules do not have, many large digital d...

AI Technical Summary

Problems solved by technology

The main differences are as follows: 1. Compared with the double-sided Clam-Shell structure, the integration of the single-sided Fly-by structure is relatively poor

2. Using conventional technology, as long as the double-sided paste structure is used, the coupling of the signal hole / return hole will be more serious, and the double-sided Clam-Shell structure will be very serious

3. Double-sided Clam-Shell structure, the unit length of the address line hangs more loads, which brings great challenges to the impedance control of the transmission channel

4. The wiring length of the Fly-by structure data group is long, which is not conducive to improving the memory access signal rate

In addition, based on the conventional printed board manufacturing process, the more advanced the performance of digital electronic equipment, the greater the number of integrated memory banks, and the more complex the printed board stack structure, the more SI / PI-related design impact brought by full through holes will be. Prominent

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