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Welding integrated bonding chopper

A hacking knife and bonding technology, which is applied in the field of welding integrated bonding hacking knife, can solve the problems of wire adhesion, insufficient temperature of the knife tip, and insufficient wire bonding strength, etc., so as to avoid wire adhesion, oxidation, and stable and continuous ball spit Effect

Active Publication Date: 2020-01-14
深圳市粤海翔精密科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing bonding capillary has the same pressure on the first bonding point and the second bonding point, and because the temperature of the tip part is not enough, problems such as insufficient wire bonding strength and wire adhesion often occur.

Method used

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  • Welding integrated bonding chopper
  • Welding integrated bonding chopper
  • Welding integrated bonding chopper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Depend on Figure 1-3 As shown, a welded integral bonded rivet includes a rivet body 1, the rivet body 1 is made of ceramic material, which can effectively insulate and heat-insulate, and a rivet mouth 6 is movably connected to the lower end of the rivet body 1, and the rivet body 1. There is a lead cavity 2 inside. The lead cavity 2 forms a tapered shape from top to bottom, and the lead wire 3 passes through the lead cavity 2. The diameter of the end of the lead cavity 2 is the same as that of the lead wire 3, so as to avoid excessive diameter of the end of the lead cavity 2. Small or too large, resulting in unsmooth spit balls or overflow of sintered balls, the upper end of the lead cavity 2 is wound with the first heating wire 4, and the lower end of the lead cavity 2 is wound with the second heating wire 5, the first heating wire 4 and the second heating wire The wires 5 are evenly wound on the outer wall of the lead cavity 2 respectively, and the first heating wire...

Embodiment 2

[0030] In the welding integrated bonding capillary described in Embodiment 1, when the cutter head 602 touches the first bonding point during wire bonding, the pressure feedback threshold of the pressure sensor 8 is N1, and the cutter head 602 contacts the second bonding point , the pressure feedback threshold of the pressure sensor 8 is N2, and 3 / 2N1≤N2≤2N1, when the riving knife main body 1 descends, the sintered ball contacts the wafer, and the sintered ball exerts a small force on the sintered ball when the cutter head 602 is bonded to the first bonding point. When the wire passes through the second bonding point, apply a larger force to make the second bonding point completely welded, and cut off once to start the next group of bonding process.

[0031] During the wire bonding process, the expansion and contraction amount of the connecting arm of the rivet nozzle 6 in the telescopic chamber 101 is consistent with the diameter of the wire wire 8, so that the wire is complet...

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PUM

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Abstract

The invention provides a welding integrated bonding chopper which comprises a chopper body; a lead cavity is formed in the chopper body, the lead cavity is conical from top to bottom, a first electricheating wire is wound around the upper end of the lead cavity, and a second electric heating wire is wound around the lower end of the lead cavity. A telescopic cavity is formed in a middle connecting arm part of the chopper body; a connecting arm of a chopper nozzle, a spring sheet fixedly connected with the connecting arm of the chopper nozzle and a pressure sensor connected with the tail end of the spring sheet are arranged in the telescopic cavity; a bonding wire groove is formed in the tail end of the chopper nozzle, and a chopper head is arranged on the outer end face of the bonding wire groove. In the lead bonding process, a first bonding point and a second bonding point are completely bonded, and large pressure is applied when the second bonding point is bonded, so that a lead iscompletely disconnected, the next group of bonding work is completed, and lead adhesion is avoided.

Description

technical field [0001] The invention relates to the field of wire bonding devices, in particular to a welding integrated bonding chopper. Background technique [0002] In the production and packaging of semiconductor devices, wire bonding has been the primary method of providing electrical interconnection between two locations within a package. Among them, the rivet is an important tool in the process of wire bonding, and its structure and performance determine the flexibility, reliability and economy of bonding. [0003] However, the existing bonding capillary has the same pressure on the first bonding point and the second bonding point, and due to the insufficient temperature of the tip part, problems such as insufficient bonding strength of the wires and adhesion of the wires often occur. [0004] Therefore, for the wire bonding process, it is necessary to develop a capillary that can improve the wire bonding strength and reduce the bonding error rate. Contents of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/603
CPCH01L24/78H01L24/85H01L2224/78252H01L2224/78282H01L2224/78313H01L2224/789H01L2224/7892H01L2224/78H01L2224/78301H01L2224/859
Inventor 杨海涛
Owner 深圳市粤海翔精密科技有限公司