Interconnected deflectable panel and node and methods for producing same
A board and node technology, applied in the field of additive manufacturing of interconnected boards
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[0018] The detailed description set forth below in connection with the accompanying drawings is intended to provide a description of various exemplary embodiments of techniques for additive manufacturing of co-printed nodes and interconnects, and is not intended to represent the only embodiments in which the invention may be practiced. Example. The term "exemplary" is used throughout this disclosure to mean "serving as an example, instance, or illustration," and is not necessarily to be construed as preferred or preferred over other embodiments provided in this disclosure. The detailed description includes specific details in order to provide a thorough and complete disclosure that will fully convey the scope of the invention to those skilled in the art. However, the present invention may be practiced without these specific details. In some instances, well-known structures and components may be shown in block diagram form, or omitted entirely, in order to avoid obscuring the ...
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