Surface detection device and method

Abstract

The invention discloses a surface detection device and method. The surface detection device comprises a rotation mechanism, a first reflection module, condensation modules and a light receiving module, wherein the first reflection module, the condensation modules and the light receiving module are sequentially arranged along a light ray propagation path, the first reflection module, the condensation modules and the light receiving module are fixedly arranged at the rotation mechanism, a through hole is arranged in the rotation mechanism and comprises a vertical part and a plurality of inclination parts, the first reflection module is arranged at the vertical part, the condensation modules are arranged at the inclination parts, the rotation mechanism rotates around a first rotation shaft, the first reflection module comprises a plurality of reflecting mirrors sequentially arranged in an adjacent way, an included angle between each reflecting mirror and a plane where a to-be-detected object is located is different, a focus point of each condensation module is coincided with a focus point of the light receiving module, the focus point is arranged on a surface of the to-be-detected object, the first reflection module is used for reflecting a detection beam to a reflection beam and then allowing the reflection beam to irradiate the surface of the to-be-detected object after condensation of the condensation module, and the light receiving module is used for converting scattering light, formed by scattering the reflection light by the surface of the to-be-detected object, to a parallel beam and emitting out the parallel beam. By the surface detection device, the detection efficiency is improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductors, and in particular, to a surface detection device and method. Background technique [0002] With the rapid development of large-scale integrated circuits, more and more attention has been paid to the influence of particle conditions on the surface of silicon wafers on device manufacturing. [0003] figure 1 It is a schematic diagram of the structure of a typical measurement device for scattering measurement of particles on the surface of silicon wafers, such as figure 1 As shown, the measurement equipment includes a body 200, wherein a workpiece table 220 for placing the silicon wafer 210 to be measured, an emission unit 230 for emitting normal incident light λ and oblique incident light μ, and a photodetector 240 are arranged inside the body 200. The normal incident light λ and the oblique incident light μ emitted by the emission unit 230 are irradiated on the surfa...

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Problems solved by technology

[0004] However, in the prior art, the detection method by moving the workpiece table is inefficient

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