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A method of stamping and forming a vapor chamber

A stamping forming, soaking plate technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of inability to guarantee product quality, limit product output, and high manufacturing costs

Active Publication Date: 2021-01-15
DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The upper and lower covers of the traditional vapor chamber are manufactured by wet etching. This method uses a large amount of oxidants and strong acids, and the waste water produced causes great pollution to the environment. At the same time, this process also uses photolithography, masks, etc. Process, complex process, high manufacturing cost
In addition, the assembly molding process is complicated. The traditional assembly process combines the upper and lower covers of the vapor chamber through the method of "pointing copper paste-manual assembly of upper and lower covers-brazing". The manufacturing time is too long, not only The output of the product is limited, and the quality of the product cannot be guaranteed

Method used

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  • A method of stamping and forming a vapor chamber
  • A method of stamping and forming a vapor chamber
  • A method of stamping and forming a vapor chamber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] figure 2 and image 3 A vapor chamber according to the method of the invention is schematically shown. like figure 1 As shown, the vapor chamber stamping forming method provided by the present invention includes the following steps:

[0033] Step (1): Two plates are provided, respectively the first cover plate 100 and the second cover plate 200; both the first cover plate 100 and the second cover plate 200 are square metal copper plates.

[0034] Step (2): Stamping the first cover plate 100 .

[0035] The middle part of the first cover plate 100 is punched into a square groove 101 by using a punching machine using a bending process. The edge of the first cover plate 100 is formed into a stepped shape by multiple times of bending, and the end of the step is trimmed, the deformed part is cut off, and a plurality of positioning pieces 102 are processed on each edge of the first cover plate 100. The positioning pieces 102 is a square shape extending downward along the...

Embodiment 2

[0047] Figure 4 and Figure 5 Another vapor chamber according to the method of the present invention is schematically shown. After the first cover plate 100 and the second cover plate 200 are welded, the line B-B coincides with the line B1-B1. The difference from Embodiment 1 is that both the first cover plate 100 and the second cover plate 200 are metal aluminum plates, and the groove 101 on the first cover plate 100 is stamped and formed by a half-shearing process, and the shape of the groove 101 The positioning pieces 102 are in the shape of a circle, and the four positioning pieces 102 are respectively located at the four edge positions of the first cover plate 100 . The plurality of protrusions 201 disposed in the middle of the second cover plate 200 are in the shape of a square column. In addition, in the processing technology, the welding method of the first cover plate 100 and the second cover plate 200 adopts diffusion welding.

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Abstract

The invention discloses a vapor chamber punch forming method. The method comprises the following steps of: providing a first cover plate and a second cover plate, stretching the middle part of the first cover plate to form a groove by adopting a pressure machining process and bending the edge to form a positioning piece, arranging a plurality of bulges in the middle of the second cover plate, welding the edges of the first cover plate and the second cover plate along the positioning pieces after a liquid absorbing core is attached to the inner wall of the first cover plate or the second coverplate and enabling the bulges on the second cover plate to be positioned in the grooves, and injecting a working fluid through a material injection port reserved in the edge, vacuumizing, and sealingthe material injection port to obtain the vapor chamber. The vapor chamber cover plate is manufactured in a punch mode, the production cost is reduced, and environmental protection is facilitated; thepositioning piece is arranged, so that the positioning precision is guaranteed, and the product percent of pass is increased; and through the welding mode, the production period of the whole technological process is greatly shortened, and efficient production is achieved.

Description

technical field [0001] The invention relates to the technical field of vapor chamber manufacturing, in particular to a stamping method for a vapor chamber. Background technique [0002] With the rapid development of 5G wireless communications, radar, drones, satellites and other fields, the application prospects of high-power radio frequency chips are becoming more and more broad. The operating speed of the chip will be greatly improved, and the heat generated by it will also increase accordingly. Ensuring its stable operation has become the top priority. Therefore, the demand and challenges for the vapor chamber will also follow, and its industrial layout will be accelerated. There is no delay. [0003] The upper and lower covers of the traditional vapor chamber are manufactured by wet etching. This method uses a large amount of oxidants and strong acids, and the waste water generated causes great pollution to the environment. At the same time, this process also uses photo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20B21D22/20B21D5/00
CPCB21D5/00B21D22/20H05K7/20336
Inventor 李海禄梁平平李学华
Owner DONGGUAN LINGJIE PRECISION MACHINING TECH CO LTD