Substrate processing method, substrate processing solution, and substrate processing device
A substrate processing method and substrate processing technology, applied in cleaning methods and tools, chemical instruments and methods, cleaning methods using liquids, etc., can solve the problems of increased substrate costs, expensive sublimation substances, collapse, etc.
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no. 1 Embodiment approach
[0071]
[0072] figure 1 It is an explanatory diagram showing the outline of the substrate processing apparatus 1 of this embodiment. figure 2 It is a schematic plan view showing the substrate processing apparatus 1 . In addition, in each figure, in order to clarify the directional relationship of the figures shown, XYZ orthogonal coordinate axes are shown suitably. figure 1 and figure 2 In , the XY plane represents the horizontal plane, and the +Z direction represents the vertical upward direction.
[0073] The substrate processing apparatus 1 can be used, for example, to process various substrates. The "substrate" refers to semiconductor substrates, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, etc. Various substrates. In this embodiment, a case where the...
no. 2 Embodiment approach
[0210] Hereinafter, a second embodiment of the present invention will be described. Compared with the first embodiment, this embodiment differs in the following points: In the solidification step S14, instead of supplying the refrigerant by the refrigerant supply member 81, nitrogen gas is supplied by the gas supply member 41, and in the sublimation step S15, nitrogen gas is not supplied. A refrigerant is supplied to the back surface Wb of the substrate W, and only nitrogen gas is supplied. In addition, it is different in that after the sublimation step S15 is performed, the inert gas supply step S16 is performed in order to prevent condensation on the surface Wf of the substrate W or the like. Also by such a configuration, the collapse of the pattern can be suppressed and the surface of the substrate can be dried favorably.
[0211]
[0212] Appropriate reference Figure 9 , the substrate processing apparatus according to the second embodiment will be described. Figure ...
Embodiment 1
[0256] In this example, using the test piece cut out from the above-mentioned silicon substrate, the drying treatment of the test piece was carried out in the following procedure, and the effect of suppressing the pattern collapse was evaluated.
[0257] First, ultraviolet light is irradiated on the surface of the test piece to make its surface characteristic hydrophilic. This makes it easy for the liquid to enter the recesses of the pattern, and artificially creates an environment where pattern collapse is likely to occur after the liquid is supplied.
[0258] Next, after putting the test piece into a small glass bottle, pour 5 ml of a substrate treatment solution at a liquid temperature of 40°C at room temperature (23°C) and atmospheric pressure (1 atm), and form a substrate treatment solution on the pattern forming surface of the test piece. liquid film. Use a saturated aqueous solution of 1,1,2,2,3,3,4-heptafluorocyclopentane (sublimation substance: 1,1,2,2,3,3,4-heptaflu...
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