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Method for protecting wafer

A technology for wafers and protection components, applied in the field of wafer protection, can solve the problems of device chip quality degradation, device quality degradation, residues, etc., and achieve the effect of solving the quality degradation

Pending Publication Date: 2020-03-06
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] After performing the grinding process, the protective tape attached to the front surface of the wafer as a protective member is peeled from the front surface of the wafer, but there is a problem that when peeling off from the wafer, a part of the adhesive paste of the protective tape adheres. Residues on the front side of the wafer will degrade the quality of the device
After the wafer supported by the frame with the adhesive tape is divided into individual device chips, when the device chips are picked up from the adhesive tape, there is still a problem that a part of the paste of the adhesive tape adheres to the device chips. Residue on the back side will reduce the quality of the device chip

Method used

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  • Method for protecting wafer

Examples

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Embodiment Construction

[0026] Hereinafter, embodiments of the wafer protection method according to the present invention will be described in detail with reference to the accompanying drawings.

[0027] When implementing the wafer protection method of this embodiment, first, a sheet preparation step is performed to prepare a sheet as a base material of a protection member used in this embodiment.

[0028] exist figure 1 A perspective view of a sheet 20 serving as a base material of a protective member is shown in . The sheet 20 is set to have a width dimension larger than the diameter of the wafer to be protected. The sheet 20 can be selected from a polyolefin-based sheet or a polyester-based sheet, and in this embodiment, a polyethylene sheet is selected from a polyolefin-based sheet. figure 1 A state is shown in which a part of the sheet 20 is pulled out in the direction indicated by the arrow X from the sheet roll 20A in which the sheet 20 is wound around the core A1 in a state where no adhesiv...

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PUM

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Abstract

Provided is a method for protecting a wafer without deteriorating the quality of a device. According to the invention, there is provided a method for protecting a wafer for protecting a wafer (10) byarranging a sheet-like protective member (22a) on a surface of the wafer (10), wherein the method for protecting the wafer comprises: a sheet preparation step for preparing a polyolefin-based sheet ora polyester-based sheet which is used as a base material of the protective member (22a); an adhesive force generating step of heating the surface of the sheet (20) to generate an adhesive force; a sheet pressing step of laying the surface of the sheet (20) on which the adhesive force is generated on the surface (front surface (10a) of the wafer (10) to be protected and applying a pressing force to press the sheet (20) to the surface (10a) of the wafer (1); and an adhesive force enhancing step of heating the sheet (20) pressed to the surface of a wafer (10) to enhance the adhesive force.

Description

technical field [0001] The present invention relates to a method for protecting a wafer. The wafer is protected by arranging a sheet-shaped protective member on the surface of the wafer. Background technique [0002] The wafer is divided by the dividing line, and multiple devices such as IC and LSI are formed on the front surface. After the wafer is ground to a predetermined thickness by grinding the back surface, the wafer is divided into individual devices by the dicing device, and is Used in electronic equipment such as mobile phones and personal computers. [0003] The grinding device includes at least: a chuck table having a holding surface for holding the wafer; a grinding unit rotatably provided with a grinding unit for grinding the upper surface of the wafer held by the chuck table. a grinding wheel; and a feeding unit for grinding and feeding a grinding wheel capable of processing a wafer to a desired thickness (for example, refer to Patent Document 1). [0004] I...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67132H01L21/6836H01L2221/68327H01L21/67103H01L21/78H01L24/86H01L24/79
Inventor 小林真椙浦一辉
Owner DISCO CORP