Packaging method of MEMS circulator
A packaging method and technology of circulators, which are applied in decorative art, microstructure devices, optical waveguide coupling, etc., can solve the problems of low efficiency and difficult packaging of MEMS circulators, and achieve small size, fast and efficient bonding, and high precision. high effect
Active Publication Date: 2020-03-17
MT MICROSYST
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Problems solved by technology
[0005] The purpose of the present invention is to provide a packaging method for MEMS circulators, aiming to solve the problems of high difficulty and low efficiency in the packaging of MEMS circulators in the prior art
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[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0029] Please also refer to Figure 1 to Figure 9 Now, a method for packaging a MEMS circulator provided by the present invention will be described. The encapsulation method of described a kind of MEMS circulator comprises the following steps:
[0030] Step S101, refer to figure 2 , preparing a metal circuit layer on the front side of the wafer 1, and preparing a metal welding layer 3 on the back side of the wafer 1, so as to obtain a plurality of chip units 2 in an integrated structure;
[0031] Step S102, refer to image 3 , preparing a solder layer 4 on the...
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Abstract
The invention provides a packaging method of an MEMS circulator, which belongs to the technical field of circulator packaging, and comprises the following steps: preparing a metal circuit layer on thefront surface of a wafer, preparing a metal welding layer on the back surface of the wafer, and obtaining a plurality of chip units in an integrated structure; preparing a solder layer on the back surface of the wafer; placing a metal carrier at a position corresponding to each chip unit on the wafer with the upward back surface, and welding the metal carrier and the back surface of the wafer into a whole; dispensing glue at the position corresponding to each chip unit on the wafer with the upward front surface, mounting a permanent magnet on the surface of the glue layer, and curing the gluelayer on the wafer on which the permanent magnet is mounted; and cutting the wafer welded with the metal carrier and pasted with the permanent magnet to obtain the independent MEMS circulator. The MEMS circulator obtained by the packaging method of the MEMS circulator provided by the invention is high in precision, small in size and good in consistency, and can be suitable for batch packaging andmanufacturing.
Description
technical field [0001] The invention belongs to the technical field of packaging of circulators, and more specifically relates to a packaging method of MEMS circulators. Background technique [0002] With the development of modern electronic technology, communication transceiver systems tend to be miniaturized, and there is an urgent need for miniaturization of RF front-end circulator products. Compared with traditional circulator products, MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) circulators use their internal magnetic materials under the combined action of an external microwave field and a DC steady magnetic field to realize electromagnetic waves in their interior according to Transmission in a certain ring direction, reverse and isolation, has the advantages of small size, high precision, high power, good reliability, etc., and has better application prospects in 5G communication and other fields. [0003] At present, the packaging of MEMS ...
Claims
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Login to View More IPC IPC(8): B81C1/00B81B7/02
CPCB81B7/02B81C1/00301
Inventor 王伟强汪蔚翟晓飞周嘉侯凯强
Owner MT MICROSYST