Positive photoresist composition and method for forming patterned polyimide layer
A technology of polyimide layer and positive photoresist, which is applied in the photoplate making process of pattern surface, photosensitive material for optical mechanical equipment, optics, etc., and can solve the chemical resistance of polyimide stripper Poor quality, affecting the quality of the patterned polyimide film, unable to protect the polyimide film as scheduled, etc., to achieve good protection effect, optimized process and quality, and excellent chemical resistance
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[0037] Below, several examples are cited to illustrate the implementation of the present invention; those skilled in the art can easily understand the advantages and effects that the present invention can achieve through the contents of this specification, and make various modifications without departing from the spirit of the present invention and changes to implement or apply the content of the present invention.
[0038] Preparation of positive photoresist composition
[0039] Various cresol-type phenolic resins (cresol-type novolac resin), diazonaphthoquinone photosensitizer (1-phenol-4-(1-(4-(2-(4-(phenolylmethyl)benzene) Diazonaphthoquinone derivatives of base) propyl group-2) phenyl)-1-(4-phenolyl phenyl) ethyl) phenyl), fluorine surfactant (MEGAFAC F-477, purchased from DIC Corporation ) and an organic solvent (2-heptanone), were mixed according to the dosage shown in Table 1 below, and were formulated into the positive photoresist compositions of Examples 1 to 3 and Co...
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