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Multispectral image sensor and imaging method thereof

A multi-spectral image and image sensor technology, applied in the multi-spectral image sensor and its imaging field, can solve the problems of application limitation, low yield and high cost

Pending Publication Date: 2020-03-27
多感科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the need for multiple photolithography and multi-layer material deposition, this method also has the disadvantages of high cost and low yield, and its application is therefore limited.

Method used

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  • Multispectral image sensor and imaging method thereof

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Embodiment Construction

[0029] Specific implementations of the multi-spectral image sensor and its imaging method provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0030] Please refer to figure 1 , is a schematic structural diagram of a multi-spectral image sensor according to a specific embodiment of the present invention.

[0031] The multispectral image sensor includes: an image sensor 110 and a filter 120 , and the filter 120 is fixed on the surface of the image sensor 110 .

[0032] The image sensor 110 includes a substrate 111 and a pixel area 112 located on the surface of the substrate 111 . Several pixel units 1 , 2 , . . . are formed in the pixel region 112 arranged in an array. Specifically, the base 111 includes a semiconductor substrate, and the pixel unit is formed in the base 111 and may be a CMOS sensing unit or a CCD sensing unit. Structures such as electrical interconnection lines may be formed in the substrate 111 f...

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Abstract

The invention relates to a multispectral image sensor and an imaging method thereof, and the multispectral image sensor comprises an image sensor which comprises a substrate and a pixel region locatedin the surface of the substrate, wherein a plurality of pixel units which are arranged in an array are formed in the pixel region; an optical filter, wherein a spectral channel area corresponding tothe pixel region is formed on the surface of the optical filter, the optical filter comprises a plurality of spectral channels which are arranged in a mosaic form and correspond to the wavelengths, and the side length of each spectral channel is larger than that of each pixel unit; wherein the optical filter is fixed on the surface of the image sensor, and a rotation deviation angle between the pixel region and the spectrum channel region is smaller than a threshold value, so that the projection of each spectrum channel on the pixel region covers at least one complete pixel unit. The multispectral image sensor is low in cost.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a multispectral image sensor and an imaging method thereof. Background technique [0002] There are two main fabrication methods for existing multispectral image sensors. One is to integrate the optics and image sensor using discrete optics such as beam splitters. The sensor manufactured by this method is bulky, heavy, and costly, and its application is limited. Another method is to use a semiconductor manufacturing method to manufacture a wedge-shaped or mosaic-shaped filter layer on the surface of the image sensor, so that different pixels on the image sensor can only receive light of a specific wavelength. Due to the need for multiple photolithography and multi-layer material deposition, this method also has the disadvantages of high cost and low yield, and its application is therefore limited. [0003] How to form a small-volume, low-cost multispectral image sensor is a pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H04N5/341H04N5/369H04N17/00
CPCH04N17/002H04N23/55H04N23/54H04N25/40H04N25/70
Inventor 王腾王威姜迪
Owner 多感科技(上海)有限公司