A 3D printing substrate cutting device

Abstract

The invention discloses a 3D printing substrate cutting device, which includes a cutting platform, on which a cutting assembly and two groups of substrate fixing platforms are respectively arranged, and the two groups of substrate fixing platforms are arranged symmetrically on both sides of the cutting assembly, and the substrate One side of the fixed platform is provided with a splinter assembly, the cutting assembly includes two sets of columns, the tops of the two sets of columns are fixedly mounted with supporting plates, and two sets of cutting plates are arranged symmetrically inside the supporting plates, and the cutting plates are slidably installed on the In the supporting plate, and the top of the cutting piece is fixedly installed with a screw sleeve, the screw sleeve is threadedly connected with a drive assembly, a lifting motor is fixedly installed between the base plate fixing platform and the cutting platform, and the upper surface of the fixing plate is fixedly installed with Conveying platform, first air cylinders are installed symmetrically on both sides of the conveying platform, the output shaft end of the first air cylinder is fixedly installed with a positioning plate, so that the scribing process and splitting process are carried out on the same platform, saving manpower.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to a 3D printing substrate cutting device. Background technique [0002] During the 3D printing process, a lot of stress will be generated, which will cause the parts to deform during the printing process. Therefore, it is necessary to print the parts on the substrate to prevent the parts from deforming. [0003] The cutting process of the substrate includes: a scribing process and a splitting process. The scribing process is to press and move a scribing wheel made of materials such as diamonds along the predetermined line of the substrate to be cut to form a scribing line. The cleaving process cuts the substrate by pressing the substrate along scribe lines to obtain unit substrates. However, in order to cut the substrate, it is necessary to separately perform the scribing process and the cleaving process, and there is a problem of increasing the number of processes...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a 3D printing substrate cutting device to solve the problem in the prior art mentioned above in the background art. However, in order to cut the substrate in the prior art, the scribing process and the splitting process need to be performed separately, which increases the process and consumes a lot of labor; the existing The unique substrate fixing device has a single form and an unstable structure. It is easy to cause displacement during the cutting process, resulting in uneven cutting and shaping, which affects the quality of the substrate.

Images