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A method for testing the uniformity of copper deposition on the surface of a cathode roll

A test method and cathode roll technology, applied in specific gravity measurement, measuring device, instrument, etc., can solve the problems of uneven coating, fish scale pattern, winding discount, etc., and achieve the effect of convenient operation

Active Publication Date: 2022-05-13
JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As we all know, uneven surface density is likely to cause abnormalities such as winding discounts, fish scales, and seersucker. At the same time, uneven surface density of copper foil in downstream enterprises will cause uneven coating and affect battery performance.

Method used

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  • A method for testing the uniformity of copper deposition on the surface of a cathode roll
  • A method for testing the uniformity of copper deposition on the surface of a cathode roll
  • A method for testing the uniformity of copper deposition on the surface of a cathode roll

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1: In steps S5 and S6, after the unwinding and foil threading operations of the small rolls on the slitter are completed, the slitter and the surface density tester are started to detect the surface density of the current small copper foil rolls; the copper foil is set Batch number, specifications, etc., stop the X-ray surface density tester and slitting machine at a distance of about 30m from the copper foil, and export the detection data (name: time + machine number), the specific data (gram weight unit g / ㎡) is as follows Shown:

[0042]

[0043] According to the above table, the surface density distribution of about 6m in longitudinal meters, the maximum value of copper foil surface density is 53.11g / ㎡, the minimum value is 52.52g / ㎡, the range is 0.59g / ㎡, the standard deviation is 0.115, and the uniformity is good. In addition, the longitudinal meter length of about 5.92m basically coincides with the perimeter of the cathode roller (about 6m), which can...

Embodiment 2

[0044] Embodiment 2: In steps S5 and S6, after the unwinding and foil threading operations of the small rolls on the slitter are completed, the slitter and the surface density tester are started to detect the surface density of the current small copper foil rolls; the copper foil is set Batch number, specifications, etc., stop the X-ray surface density tester and slitting machine at a distance of about 30m from the copper foil, and export the detection data (name: time + machine number), the specific data (gram weight unit g / ㎡) is as follows Shown:

[0045]

[0046]

[0047] According to the above table, the surface density distribution with a longitudinal meter length of about 6m is obtained. The maximum copper foil surface density is 52.95g / ㎡, the minimum value is 52.56g / ㎡, the range is 0.39g / ㎡, the standard deviation is 0.089, and the uniformity is very good. In addition, the longitudinal meter length of about 6.15m basically coincides with the perimeter of the cathod...

Embodiment 3

[0048] Embodiment 3: In steps S5 and S6, after the small roll is unwound and foil-threaded on the slitter, start the slitter and the areal density tester to detect the areal density of the current small copper foil roll; set the copper foil Batch number, specifications, etc., stop the X-ray surface density tester and slitting machine at a distance of about 30m from the copper foil, and export the detection data (name: time + machine number), the specific data (gram weight unit g / ㎡) is as follows Shown:

[0049]

[0050] According to the above table, the surface density distribution with a longitudinal meter length of about 6m is obtained. The maximum value of the surface density of copper foil is 52.86g / ㎡, the minimum value is 52.51g / ㎡, the range is 0.35g / ㎡, the standard deviation is 0.080, and the uniformity is very good. In addition, the longitudinal meter length of about 5.80m basically coincides with the perimeter of the cathode roller (about 6m), which can characterize...

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Abstract

The invention discloses a method for testing the uniformity of copper deposition on the surface of a cathode roll, which comprises the following steps: installing the cathode roll on a foil production machine, starting the foil production machine; collecting copper foil small rolls after each performance of the foil production machine is in normal operation; The collected small copper foil rolls are transported by the transport trolley to the special slitting machine, and the surface density tester is installed on the slitting machine; according to the operating standard, the small copper foil rolls are put on the slitting machine, and the appropriate tension is set; open The slitter and surface density tester perform unwinding and foil threading operations to detect the surface density of the current copper foil roll; stop the slitter and surface density tester to collect surface density detection data and form a uniformity thermodynamic map. Beneficial effects of the present invention: by detecting the collected copper foil rolls, the operation is convenient, and the uniformity of copper deposition on the peripheral surface density of the cathode roller can be accurately and stably detected, so that the uneven copper deposition on the peripheral surface density of the cathode roller can be eliminated before production In order to ensure that the copper foil produced meets the surface density requirements.

Description

technical field [0001] The invention relates to the technical field of cathode roll testing, in particular to a method for testing the uniformity of copper deposition on the surface of a cathode roll. Background technique [0002] Before the production of electrolytic copper foil, it is necessary to test the uniformity of copper deposition on the surface density of the cathode roller, and then proceed to production after meeting the requirements. Electrolytic copper foil is the basic material for PCB boards, copper clad laminates and lithium-ion batteries. With the advent of the 5G era As well as the rapid development of the new energy vehicle industry, copper foil will also usher in a new round of vigorous development, and will also intensify competition in the industry. This requires that the produced copper foil has good physical properties, especially surface density. As we all know, uneven surface density is likely to cause abnormalities such as winding discounts, fish...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N9/36C25D1/04
CPCG01N9/36C25D1/04
Inventor 童哲罗佳
Owner JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD