Printed circuit board production process for slotting in middle of IC bonding pad

Abstract

Printed circuit board production process for slotting in the middle of an IC bonding pad relates to the technical field of circuit boards. The process comprises: carrying out a primary routing step; performing one-time routing, and performing routing and slotting on an IC area of a circuit board; performing plate grinding; performing pattern transfer for the first time; performing wet ink patterntransfer according to the IC bonding pad position and the slotting position of the circuit board; performing pattern transfer for the second time; performing dry film pattern transfer on other positions, except the IC bonding pad position and the slotting position, of the circuit board, wherein the pattern transferred for the second time is connected with the pattern transferred for the first time; performing pattern electroplating; performing alkaline etching; and performing an etching subsequent step. After the one-time routing, a sand belt board grinding step is added, so that the flatnessof the IC pin is ensured; and wet ink is adopted for the pattern transfer in the IC area, a dry film is adopted for the pattern transfer in other areas, and the binding force of the wet ink and the board surface is superior to that of the dry film and the board surface, so that the problems of short circuit and IC edge complementary biting corrosion caused by liquid medicine in the electroplatingprocess can be avoided.

Description

technical field [0001] The present application relates to the technical field of circuit boards, in particular to a production process of printed circuit boards with slots in the middle of IC pads. Background technique [0002] In the printed circuit board manufacturing industry, there are three methods for manufacturing printed circuit boards with slots in the middle of IC pads: [0003] The first one is to slot the gong board in the middle of the IC pad after pattern electroplating, and then perform etching. This method is due to the thick copper skin after copper plating, and the copper skin rolls up and the copper skin is pulled during the first gong board. The edge of the IC pad is bitten; [0004] The second method is to slot the gong board once after the board is electroplated, and then transfer the pattern. In this method, the copper skin is rolled up and the pattern is transferred during the gong board process. After the pattern is transferred, the potion passes th...

AI Technical Summary

Problems solved by technology

[0003] The first one is to slot the gong board in the middle of the IC pad after pattern electroplating, and then perform etching. This method is due to the thick copper skin after copper plating, and the copper skin rolls up and the copper skin is pulled during the first gong board. The edge of the IC pad is bitten;

[0004] The second method is to slot the gong board once after the board is electroplated, and then transfer the pattern. In this method, the copper skin is rolled up and the pattern is transferred during the gong board process. After the pattern is transferred, the potion passes through the slotted hole during the pattern electroplating process. When the dry film on the edge of the groove is loosened, the edge of the groove is plated with copper and tin, thus forming a small short circuit between the IC pins after etching;

[0005] The third method is to directly use a punching machine to punch the groove in the middle of the IC pad after the writing is completed. This method has the phenomenon of edge bursting and copper roll-up after punching the board.

[0006] In summary, the manufacturing methods of slotted printed circuit boards in the middle of IC pads in the prior art all have their own shortcomings. Therefore, there is a lack of a circuit board production process that can avoid the above-mentioned technical problems.

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