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A kind of compound surface treatment method of cathode for microwave vacuum electronic device

An electronic device, microwave vacuum technology, applied in the cleaning method using liquid, the cathode of the transit time type electron tube, chemical instruments and methods, etc., can solve the problem of excessive cathode evaporation, cathode surface extrusion, aluminate failure, etc. problems, to achieve the effect of reducing evaporation rate, improving cathode life, and improving surface quality

Active Publication Date: 2022-07-01
NANJING SANLE GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the cathode manufacturing process, defects are inevitable: surface oxides, residual salts (aluminate), these defects affect the performance and reliability of the cathode
This method is relatively simple and effective, and can remove most of the aluminates and oxides on the surface of the cathode, but this method is likely to cause defects such as residual salt in the cathode gap, extrusion of the cathode surface, and changes in the radius of curvature of the cathode, especially for space cathodes. (diameter size is too small)
Residual salt in the gap will cause excessive evaporation of the cathode, which will affect the life of the microwave device; surface extrusion will make the cathode’s ability to emit electrons worse, affecting the emission signal; changes in the size of the radius of curvature of the cathode will change the electron beam emitted by the cathode. Interactions affecting signals
[0004] At present, chemical wet etching (ethylenediaminetetraacetic acid) is proposed abroad to treat oxides and residual salts on the surface of the cathode, but the chemical solution enters the pores of the cathode substrate, which may easily cause aluminate failure and change the pore state of the cathode substrate.
Domestically, it is proposed to wash with deionized water to remove the residual salt on the surface of the cathode, but this process cannot remove the surface oxide

Method used

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  • A kind of compound surface treatment method of cathode for microwave vacuum electronic device
  • A kind of compound surface treatment method of cathode for microwave vacuum electronic device
  • A kind of compound surface treatment method of cathode for microwave vacuum electronic device

Examples

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Effect test

Embodiment 1

[0025] The method for compound surface treatment of a cathode for a microwave vacuum electronic device described in this embodiment includes the following steps:

[0026] (1) the cathode is wet-processed, as follows:

[0027] (a) The cathode is placed in the mold, the mold makes the surface of the cathode 1 face down, and the heater part 2 faces up, and ultrasonically cleans it in deionized water for 5 minutes, and the power of the ultrasonic instrument is 200W; ultrasonic cleaning can dissolve the surface and pores Aluminate removal. The installation of cathode and hot sub-section is as attached figure 1 .

[0028] (b) the cathode is placed in the mold, the mold makes the surface of the cathode face downward, and the heater part faces upward, and ultrasonically cleans it in acetone for 3min, and the power of the ultrasonic instrument is selected as 200W; Remove the organic matter that may be contaminated on the surface;

[0029] (c) Place the cathode in the mold, with the ...

Embodiment 2

[0034] The method for compound surface treatment of a cathode for a microwave vacuum electronic device described in this embodiment includes the following steps:

[0035] (1) the cathode is wet-processed, as follows:

[0036] (a) Place the cathode in the mold, with the surface of the cathode facing down and the hot part facing up, ultrasonically clean in deionized water for 25 minutes, and the power of the ultrasonic instrument is 50W; ultrasonic cleaning can dissolve aluminate on the surface and pores Salt removal.

[0037] (b) the cathode is placed in the mold, the mold makes the surface of the cathode face downward, and the heater part faces upward, and ultrasonically cleans it in acetone for 5 min, and the power of the ultrasonic instrument is selected as 50W; Remove the organic matter that may be contaminated on the surface;

[0038] (c) Place the cathode in the mold, with the surface of the cathode facing down and the heater part facing up, ultrasonically clean in alcoh...

Embodiment 3

[0043]The method for compound surface treatment of a cathode for a microwave vacuum electronic device described in this embodiment includes the following steps:

[0044] (1) the cathode is wet-processed, as follows:

[0045] (a) Place the cathode in the mold, and ultrasonically clean it in deionized water for 10 min. The power of the ultrasonic instrument is 100 W; ultrasonic cleaning can remove the aluminate dissolved in the surface and pores.

[0046] (b) the cathode is placed in the mold, the mold makes the surface of the cathode face downward, and the heater part faces upward, and ultrasonically cleans it in acetone for 4min, and the power of the ultrasonic instrument is selected as 150W; Remove the organic matter that may be contaminated on the surface;

[0047] (c) Place the cathode in the mold, with the surface of the cathode facing down and the heater part facing up, ultrasonically clean in alcohol for 15 min, and the power of the ultrasonic instrument is selected as 1...

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Abstract

The invention discloses a method for compound surface treatment of a cathode for a microwave vacuum electronic device, which comprises the following steps: (1) wet-processing the cathode; (2) drying the wet-treated cathode; (3) The dried cathode is placed in a high temperature furnace for purification reduction annealing treatment; (4) the annealed cathode is subjected to plasma etching; the present invention adopts a wet method to remove the residual salt on the surface of the cathode, and the evaporation rate of the cathode is compared with the traditional process The method is doubled, and the oxide and surface deformation layer on the surface of the cathode are removed by plasma etching, the cathode surface with clean surface and no change in the curvature dimension is prepared, and the life of the cathode and the anti-toxicity are improved.

Description

technical field [0001] The invention relates to a method for surface treatment of cathodes, in particular to a method for compound surface treatment of cathodes for microwave vacuum electronic devices. Background technique [0002] Microwave vacuum electronic devices play an irreplaceable role in the global defense equipment and national economy. Among them, traveling wave tubes are widely used in radar, precision guidance, electronic It is known as the heart of military electronic equipment in related systems such as countermeasures, deep space exploration systems and interstellar communication. With the rapid development of microwave electronic devices such as weapon equipment and commercial communication satellites, higher requirements are placed on traveling wave tubes: miniaturization, long life, and high reliability. These stringent requirements are closely related to the "heart" cathode of the TWT. As the core component of the TWT's normal operation, the cathode emit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J9/02H01J23/04B08B3/12B08B7/00
CPCH01J9/02H01J23/04B08B3/12B08B7/00
Inventor 范亚松胡文景梁田王玉春马静赵请张毅张坤
Owner NANJING SANLE GROUP