Conductive paste, three-dimensional printed circuit, touch sensor, and methods respectively for producing those products
A touch sensor, conductive paste technology, applied in printed circuit manufacturing, printed circuit, cable/conductor manufacturing, etc., can solve problems such as peeling, disconnection and wiring, and achieve the effect of good adhesion
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[0049] The following examples illustrate the invention. In the examples, what is simply referred to as "part" means a part by mass. In addition, the method of each measurement item is as follows.
[0050] (1) Number average particle size of primary particles
[0051] The coating film was observed with a scanning electron microscope (SEM) at a magnification of 5000, and the particle diameters of 100 particles which could be distinguished as one particle were randomly measured and averaged to obtain the average particle diameter of the primary particle diameter.
[0052] (2) Glass transition temperature (Tg)
[0053] Put 5 mg of the sample resin into an aluminum sample pan and seal it, and use a differential scanning calorimeter (DSC) DSC-220 manufactured by Seiko Instruments to measure at -50 to 200°C and a heating rate of 20°C / min. The intersection point temperature of the extension line of the baseline below the transition temperature and the tangent line with the maximum ...
Embodiment 2~10
[0072] ,
[0073] Hereinafter, similarly to Example 1, using the materials shown in Table 1 and Table 2, an electrically conductive paste for molding processing was prepared and evaluated respectively. The results are shown in Table 1 and Table 2.
[0074] The physical properties of the coating film and the environmental test of any of the examples were good. In addition, good results were obtained in terms of storage stability and printability. On the other hand, in Comparative Examples 1 and 2, spherical silver and flaky silver were used, and wire breakage occurred after molding. In Comparative Example 3, spherical silver and aggregated silver particles were used together, and wire breakage occurred after molding. In Comparative Example 4, a resin having a glass transition temperature of 95° C. was used, and disconnection occurred after molding.
[0075] In addition, the resins, conductive powders, curing agents, catalysts, and solvents in the table were used as follows...
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