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Conductive paste, three-dimensional printed circuit, touch sensor, and methods respectively for producing those products

A touch sensor, conductive paste technology, applied in printed circuit manufacturing, printed circuit, cable/conductor manufacturing, etc., can solve problems such as peeling, disconnection and wiring, and achieve the effect of good adhesion

Active Publication Date: 2020-04-10
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the proposed conductive paste uses flaky silver powder, and when forming a 3D shape such as the dome shape required in recent years or a more complex shape, wire breakage or Problems such as wiring stripping

Method used

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  • Conductive paste, three-dimensional printed circuit, touch sensor, and methods respectively for producing those products
  • Conductive paste, three-dimensional printed circuit, touch sensor, and methods respectively for producing those products
  • Conductive paste, three-dimensional printed circuit, touch sensor, and methods respectively for producing those products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0049] The following examples illustrate the invention. In the examples, what is simply referred to as "part" means a part by mass. In addition, the method of each measurement item is as follows.

[0050] (1) Number average particle size of primary particles

[0051] The coating film was observed with a scanning electron microscope (SEM) at a magnification of 5000, and the particle diameters of 100 particles which could be distinguished as one particle were randomly measured and averaged to obtain the average particle diameter of the primary particle diameter.

[0052] (2) Glass transition temperature (Tg)

[0053] Put 5 mg of the sample resin into an aluminum sample pan and seal it, and use a differential scanning calorimeter (DSC) DSC-220 manufactured by Seiko Instruments to measure at -50 to 200°C and a heating rate of 20°C / min. The intersection point temperature of the extension line of the baseline below the transition temperature and the tangent line with the maximum ...

Embodiment 2~10

[0072] ,

[0073] Hereinafter, similarly to Example 1, using the materials shown in Table 1 and Table 2, an electrically conductive paste for molding processing was prepared and evaluated respectively. The results are shown in Table 1 and Table 2.

[0074] The physical properties of the coating film and the environmental test of any of the examples were good. In addition, good results were obtained in terms of storage stability and printability. On the other hand, in Comparative Examples 1 and 2, spherical silver and flaky silver were used, and wire breakage occurred after molding. In Comparative Example 3, spherical silver and aggregated silver particles were used together, and wire breakage occurred after molding. In Comparative Example 4, a resin having a glass transition temperature of 95° C. was used, and disconnection occurred after molding.

[0075] In addition, the resins, conductive powders, curing agents, catalysts, and solvents in the table were used as follows...

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Abstract

Provided is a conductive paste which can prevent the disconnection of a conductive part which can be caused upon the thermal stretching during molding. A conductive paste for molding processing use can be produced by mixing and dispersing aggregated silver particles, a resin having a glass transition temperature of 80 DEG C or lower, a curing agent and a solvent together. It is preferred that theaggregated silver particles to be contained have a tap density of 2 to 5 g / cm<3> and a specific surface area of 0.5 to 2.0 m<2> / g, the primary particle diameter of the aggregated silver particles is 0.1 to 3 [mu]m when the particle diameters of the aggregated silver particles are measured with a scanning electron microscope, and the resin has a glass transition temperature of 60 DEG C or lower anda number average molecular weight of 5000 to 40000. The conductive paste is suitable for use applications where the whole body of a base material is thermally deformed to form a three-dimensional circuit after the formation of a printed circuit, and is particularly suitable for the formation of a fine wire for a touch sensor.

Description

technical field [0001] The present invention relates to a conductive paste, and more specifically, to a conductive paste for forming processing, which can be used to form display panels and operation panels of home appliances, mobile phones, portable information equipment, and automotive interior parts. Three-dimensional structure circuit sheet, curved surface printed wiring board, wiring in three-dimensional circuit components. It relates to a conductive paste that can prevent circuit pattern disconnection caused by heat stretching during molding. Background technique [0002] In recent years, in order to improve the design and operability of electrical appliances, the development of three-dimensional (three-dimensional) operation surfaces has been very active, and the demand for printed circuit boards and touch sensors with three-dimensional structures has increased. As a method of producing circuit sheets and three-dimensional molded products having such electrical circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22C08K3/04C08K3/08C08L101/12H01B5/14H01B13/00H05K3/12
CPCC08K3/04H05K3/12H01B1/22H01B5/14C08K2003/0806C08L67/00C08L75/04H01B1/24C08K3/08G06F3/041C08K2201/005G06F2203/04103H05K3/1275
Inventor 多贺圭子
Owner TOYOBO CO LTD