Unlock instant, AI-driven research and patent intelligence for your innovation.

Thin film transistor, manufacturing method thereof and thin film transistor array

A technology of thin film transistors and manufacturing methods, applied in the field of semiconductor optoelectronics, can solve problems affecting TFT performance, damage, etc., and achieve the effect of low cost and simple manufacturing methods

Active Publication Date: 2020-04-10
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the deficiencies in the above-mentioned prior art, the purpose of the present invention is to provide a thin film transistor and its manufacturing method and a thin film transistor array, which overcome the problem of the etchant when etching multiple source-drain electrodes in the prior art. Defects that can destroy the metal oxide semiconductor of IGZO, thereby affecting the performance of the entire TFT

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin film transistor, manufacturing method thereof and thin film transistor array
  • Thin film transistor, manufacturing method thereof and thin film transistor array
  • Thin film transistor, manufacturing method thereof and thin film transistor array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0047] When etching the source electrode layer and the drain electrode layer in the prior art, the etchant will damage the metal oxide semiconductor layer, thereby affecting the performance of the entire TFT. In order to solve the above problems, Embodiment 1 of the present invention provides a method for manufacturing a thin film transistor.

[0048] Please refer to figure 1 and figure 2 , figure 1 It is a flowchart of a preferred embodiment of a manufacturing method of a thin film transistor provided by the present invention; figure 2 It is a process schematic diagram of a manufa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a thin film transistor, a manufacturing method thereof and a thin film transistor array. The manufacturing method comprises the following steps: forming a gate insulating layeron a gate electrode layer; continuously depositing a metal oxide semiconductor layer and an etching protection layer on the gate insulation layer; forming a metal electrode layer on the gate insulation layer and the etching protection layer; etching the metal electrode layer to form a source electrode layer and a drain electrode layer; and etching the etching protection layer to expose the metal oxide semiconductor layer. According to the invention, the etching protection layer is formed on the metal oxide semiconductor layer; when the metal electrode layer and the ITO layer are etched, the metal oxide semiconductor layer is protected by etching the protective layer, so that the metal oxide semiconductor layer is prevented from being etched by etching liquid to influence the performance ofthe thin film transistor, the protective layer does not need to be additionally arranged when the metal oxide semiconductor layer is protected, the manufacturing method is simple, and the cost is low.

Description

technical field [0001] The invention belongs to the technical field of semiconductor optoelectronics, and in particular relates to a thin film transistor, a manufacturing method thereof and a thin film transistor array. Background technique [0002] With the development of display technology, various display devices such as liquid crystal display (LCD) devices, organic electroluminescent display (OLED) devices, or inorganic electroluminescent display (Mini-LED, Micro-LED) devices have been widely used. Each liquid crystal pixel in a liquid crystal display (LCD) device is driven by a thin-film transistor (TFT) integrated behind the pixel, so that high-speed, high-brightness, high-contrast display information can be achieved, which is currently the best One of the color display devices. [0003] The TFT includes a semiconductor layer, which has a source / drain region doped with a high-concentration dopant and a channel region formed between the source / drain regions, a gate ele...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/34H01L29/786H01L27/12
CPCH01L29/66969H01L29/78693H01L27/1214H01L27/1225H01L27/1255H01L27/1288H01L27/124
Inventor 李刘中伍凯义林子平
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD