Display substrate and manufacturing method thereof

Abstract

The present invention provides a display substrate and a manufacturing method thereof. The display substrate comprises a backboard and a plurality of Micro-LED chips, each Micro-LED chip comprises a first electrode and a second electrode, the backboard is equipped with a groove, and the Micro-LED chip is inserted in the groove to be electrically connected with the backboard via the first and second electrodes. According to the present invention, the grooves matched with the first and second electrodes are arranged on the backboard, when the Micro-LED chips have defects, only the Micro-LED chips having the defects need to be plugged out from the grooves, and the Micro-LED chip not having the defects is inserted in the corresponding groove again, so that the Micro-LED chip is more convenientto replace, and the problem in the prior art that the chip loosens and displaces due to heating a pad to replace the Micro-LED chips, is overcome.

Description

technical field [0001] The invention belongs to the technical field of semiconductor optoelectronics, and in particular relates to a display substrate and a manufacturing method thereof. Background technique [0002] Micro-LED technology, that is, LED miniaturization and matrix technology, has the advantages of good stability, life, and operating temperature, and also inherits the advantages of LED low power consumption, color saturation, fast response speed, and strong contrast , Micro-LED has higher brightness and lower power consumption, which makes Micro-LED have great application prospects. At present, most of the ways to install Micro-LED chips on the backplane are to first set up solder bumps on the corresponding electrode positions on the backplane, and align and connect the electrodes of the Micro-LED chip with the solder bumps, and the solder bumps will melt under heating. State, cooled and solidified to realize the electrical connection between the Micro-LED chip...

AI Technical Summary

Problems solved by technology

[0005] In view of the deficiencies in the above-mentioned prior art, the object of the present invention is to provide a display substrate and its manufacturing method, which overcomes the problem that the Micro-LED chips in the existing display substrate are electrically connected to the backplane through solder bumps. When the chip is defective, it is necessary to melt the solder block by heating to separate the defective Micro-LED chip from the backplane, which will easily cause the normal Micro-LED chip adjacent to the defective Micro-LED chip to loosen and shift, affecting its luminous performance Defects

Images