Carbon nanofiber membrane for electromagnetic shielding and resin composite board and preparation methods thereof
A nano-carbon fiber and nano-fiber film technology, which is applied in the field of new material technology and composite materials, can solve problems such as the difficulty of preparing nano-carbon fiber film, and achieve good electromagnetic shielding performance, simple preparation method, and light weight.
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[0029] Example 1: Dissolve 6g of PAN powder in 50mL of DMF to prepare a PAN solution with a concentration of 12%, put the PAN solution into the bolus injector, set the spinning distance to 15cm, and the bolus speed to 2.5mL / h. The spinning voltage is 15kV, and the PAN nanofiber membrane is prepared by electrostatic spinning; the PAN nanofiber membrane is placed in a pre-oxidation furnace, and the pre-oxidation temperature is set to 260°C for 120 minutes, and the pre-oxidation is performed to obtain a PAN pre-oxidized film; The PAN pre-oxidized film is placed in a carbonization furnace, and the carbonization temperature is set to 1400°C and the time is 120min. The carbonization is performed to obtain a carbonized film; the carbonized film is placed in the graphitization furnace, and the temperature is set to 2400°C and the time is 120min for graphitization. Processing to obtain nano carbon fiber membrane for electromagnetic shielding, figure 1 It is an optical photo of the prepar...
Example Embodiment
[0031] Example 2: This example is basically the same as Example 1. The differences are: PAN solution concentration is 5%, voltage is 15kV, spinning distance is 18cm, pre-oxidation temperature is 250°C, pre-oxidation time is 3h, carbonization temperature It is 1000℃, the carbonization time is 3h, the graphitization temperature is 2000℃, the graphitization time is 3h, the heating temperature of the surface oxidation treatment is 350℃, the heating time is 30min, the applied pressure is 1.2MPa, the curing temperature is 100℃, and the curing The time is 30min.
[0032] The tensile strength of the resin composite board prepared in this embodiment is 62.5 MPa, and the electromagnetic shielding efficiency in the range of 30 MHz to 5 GHz is about 28 dB.
Example Embodiment
[0033] Example 3: This example is basically the same as Example 1. The differences are: PAN solution concentration is 15%, voltage is 12kV, spinning distance is 10cm, pre-oxidation temperature is 300°C, pre-oxidation time is 1h, carbonization temperature 1400℃, carbonization time is 1h, graphitization temperature is 2400℃, graphitization time is 1h, heating temperature for surface oxidation treatment is 450℃, heating time is 30min, applied pressure is 0.8MPa, curing temperature is 70℃, curing The time is 60min.
[0034] The tensile strength of the resin composite board prepared in this embodiment is 67.5 MPa, and the electromagnetic shielding efficiency in the range of 30 MHz to 5 GHz is about 28 dB.
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