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Die ejecting apparatus

A demoulding device and mold technology, applied in metal processing, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as poor picking and mold damage, and achieve the effect of preventing poor picking

Active Publication Date: 2020-04-21
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a mold ejector of a new form that can solve problems such as mold damage and pick-up failure in the mold cutting process related to large molds.

Method used

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  • Die ejecting apparatus
  • Die ejecting apparatus
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Embodiment Construction

[0021] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention. However, the present invention is not limited to the embodiments described below, and can be embodied in various forms different therefrom. The following embodiments are not intended to complete the present invention, but to enable those skilled in the art to which the present invention pertains to more fully understand the scope of the present invention.

[0022] When it is described that one element is disposed on or connected to another element, the above-mentioned element may be directly disposed on or directly connected to the other element, or there may be other elements or layers between them. Contrary to this, when it is described that one element is directly disposed on or directly connected to another element, there is no other element in between. In order to explain various items such as various element...

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PUM

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Abstract

The invention relates to a die ejecting apparatus. The die ejecting apparatus includes: an ejecting module having a conduit and a plurality of ejecting tubes formed so as to heavily surround the outside of the conduit; a housing for accommodating the ejecting module, the housing having an opening through which the plurality of ejecting tubes protrude upward; and a drive unit that drives the plurality of ejecting tubes in the vertical direction. The plurality of ejecting tubes protrude upward by a plurality of springs after being lowered by the drive unit, and in the plurality of ejecting tubesprotruding upward, the plurality of ejecting tubes are sequentially lowered from the ejecting tubes disposed on the outer side to be separated from the edge portion of a die.

Description

technical field [0001] The present invention relates to a mold release device, and more particularly, to a mold release device for separating a mold from a substrate in a semiconductor manufacturing process. Background technique [0002] Generally, a semiconductor device is formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the plurality of semiconductor devices are formed can be divided into a plurality of molds through a dicing process, and the plurality of molds can be welded to the substrate through a welding process. [0003] The apparatus for performing the die bonding process described above may include: a pick-up module that picks up the plurality of dies from a wafer divided into the dies and separates them; and a welding module that attaches the picked-up dies to the substrate. The pick-up module may include: a stage unit for supporting a wafer ring to which the above-mention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B26D7/01B26D7/00
CPCH01L21/67011B26D7/018B26D7/00H01L21/67132H01L21/6836H01L21/67259
Inventor 李喜澈
Owner SEMES CO LTD