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A computer mainframe placement device for uniform heat dissipation

A uniform heat dissipation and computer technology, applied in the computer field, can solve the problems of reducing the service life of the computer, reducing the work efficiency of the user, and the slow operation of the host computer, achieving high promotion and application value, facilitating reliable placement, and improving support reliability.

Inactive Publication Date: 2021-04-23
NINGDE NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Nowadays, the computer industry is developing rapidly. When the computer host is running, it will run too slowly due to overheating, which reduces the user's work efficiency, brings inconvenience to people's life, and reduces the service life of the computer.

Method used

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  • A computer mainframe placement device for uniform heat dissipation
  • A computer mainframe placement device for uniform heat dissipation
  • A computer mainframe placement device for uniform heat dissipation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] see figure 1 , in an embodiment of the present invention, a computer mainframe placement device for uniform heat dissipation includes a base 8, a ventilation cavity 12 is opened in the middle of the inner side of the base 8, and an annular cavity 10 is opened outside the ventilation cavity 12. The ventilation The upper part of the chamber 12 has a conical structure, and the ventilation chamber 12 communicates with the outside world through the return air outlet 5 provided in the middle of the top, and a group of adjustable movable The heat dissipation limiting assembly communicates with the bottom of the ventilation chamber 12 through the hose 9, and the ventilation cooling assembly is installed in the ventilation chamber 12, and the ventilation cooling assembly is used to draw the outside air from the back The tuyere 5 is sucked into the ventilation chamber 12, and delivered to the heat dissipation limiting assembly through the hose 9; the top of the base 8 is also pro...

Embodiment 2

[0029] see Figure 1-5 , the difference between this embodiment and embodiment 1 is:

[0030] Further, the ventilation and cooling assembly includes fan blades 13, a motor 14, a support rod 15, a connecting net plate 16 and a cooling element 17, the motor 14 is arranged in the middle of the ventilation cavity 12, and the output shaft of the motor 14 is fixed with Fan blade 13, the motor 14 is distributed and fixed with a plurality of support rods 15 in the outer circumferential direction, the outer ends of the support rods 15 are fixed on the cavity wall of the ventilation chamber 12, and the motor 14 can be supported by a plurality of support rods 15 fixed; as Figure 4 As shown, the two adjacent support rods 15 are also installed and fixed with a connecting net plate 16, and a plurality of cooling elements 17 are installed on the upper side of the connecting net plate 16, through which the air flowing through can be refrigerated. Cool down, the specific control connection ...

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Abstract

The invention relates to the field of computers, in particular to a computer mainframe placement device for uniform heat dissipation, including a base, a ventilation cavity is opened in the middle of the inner side of the base, and an annular cavity is opened outside the ventilation cavity, and the ventilation cavity is set in the middle of the top The air return port of the base is connected to the outside world. A set of adjustable and movable heat dissipation limit components are respectively installed on the front, rear, left and right sides of the top of the base. A ventilation and cooling component is also installed in the cavity; a supporting and fixing component corresponding to the heat dissipation limiting component is also arranged on the top of the base. The invention has a novel structural design, is beneficial to the reliable placement of the host and uniform heat dissipation, and has high popularization and application value.

Description

technical field [0001] The invention relates to the field of computers, in particular to a computer mainframe placement device for uniform heat dissipation. Background technique [0002] Nowadays, the computer industry is developing rapidly. When the mainframe of the computer is running, it will run too slowly due to overheating, which reduces the work efficiency of the user, brings inconvenience to people's life, and reduces the service life of the computer. [0003] Therefore, in view of the above current situation, there is an urgent need to develop a computer host auxiliary device that is beneficial to the reliable placement of the host and uniform heat dissipation, so as to overcome the shortcomings in current practical applications. Contents of the invention [0004] The purpose of the embodiments of the present invention is to provide a computer mainframe placement device for uniform heat dissipation, so as to solve the problems raised in the background art above. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16M11/04F16M11/20G06F1/20
CPCF16M11/041F16M11/20G06F1/20
Inventor 李志亮罗芳余腾腾
Owner NINGDE NORMAL UNIV