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Laser grooving device and method

A laser slotting and laser beam technology, which is applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve problems such as unstable dimensional accuracy, workpiece heating and melting, and microcracks

Active Publication Date: 2021-03-16
WUHAN UNIV
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current laser grooving uses laser as the heat source to process the workpiece, and the light energy is converted into heat energy. After absorbing the heat energy, the material heats up and forms a molten pool on its surface, and the surface material is continuously melted and removed. The disadvantages of this method are: 1. , during the slotting process of the high-power laser, the workpiece is heated and melted, and high-temperature plasma is generated above the workpiece
2. The impact force generated during the high-energy long-pulse laser drilling process is too large, resulting in low repeatability of the processed grooves, micro-cracks on the inner wall, and unstable dimensional accuracy.

Method used

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  • Laser grooving device and method

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Embodiment Construction

[0035] refer to figure 1 , shows a prior art laser grooving device. The laser grooving device includes a marble base 1 , a workpiece clamping unit 2 , a frame 3 , a laser optical path unit 4 , a laser 5 and a control unit 6 . The marble base 1 is used for horizontal positioning and vertical positioning, which is convenient for the control unit 6 to accurately control the spatial movement direction of the rack 3 and the laser optical path unit 4 . The workpiece clamping unit 2 is located on the marble base 1 and is used for fixing the workpiece 11 , while the workpiece clamping unit 2 can move horizontally relative to the marble base 1 . The frame 3 is fixed on the marble base 1, wherein the laser 5 and the laser optical path unit 4 are fixed on the frame 3, and the laser optical path unit 4 can move along the frame 3 in X (left and right) and Z (up and down) directions. The laser 5 generally adopts a pulsed laser, which can be a nanosecond, picosecond, or femtosecond laser. ...

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Abstract

The invention discloses a laser grooving device and method. The method comprises the steps that beam splitting is carried out on laser beams generated by laser, the laser beams are divided into threelaser beams, the energy proportions of the main laser beam and the auxiliary laser beams are different, the main laser beam and the auxiliary laser beams act on the surface of a workpiece through focusing lenses, wherein the main laser beam performs shaping treatment through a flat top shaping element and is used for ablating a material for grooving, and the auxiliary laser beams generate shock waves in the material by hitting the surface of the workpiece to control the disturbance direction of plasma generated during grooving of the main laser beam, so that control over the groove edge sharpness is achieved, and the groove machining quality is improved.

Description

technical field [0001] The invention relates to advanced laser micro-nano manufacturing technology, belongs to the field of laser manufacturing and processing, and in particular relates to a laser slotting device and method. Background technique [0002] Nowadays, with the rapid development of science and technology, the requirements for the precision of equipment in various fields such as mechanical processing, aerospace, and communication electronics are getting higher and higher. For the processing of micro and small structures, the traditional processing methods cannot meet the precision requirements. Laser processing came into being, which has the advantages of small heat generation, non-contact, high efficiency, high processing accuracy and no tool wear. Laser grooving technology is widely used in the processing of metal and non-metal materials, and is one of the key technologies in the field of modern manufacturing technology. [0003] Laser slotting is to use a foc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/364B23K26/06B23K26/067B23K26/70
CPCB23K26/0648B23K26/0673B23K26/364B23K26/702
Inventor 刘胜张臣赵建果程佳瑞
Owner WUHAN UNIV
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