Lens module, preparation method of lens module and camera

Abstract

The invention provides a preparation method of a lens module. The preparation method comprises the following steps that S1, a bottom mold is provided, and a lens material layer is formed on the bottommold; S2, a top mold is provided, the top mold and the bottom mold are aligned and pressed, the lens material layer is cured to form a plurality of lenses, wherein each lens comprises a curved surface area and a plane area surrounding the curved surface area; S3, a lens material layer is formed on the lenses; and S4, the step S2 is executed again or the step S2 and the step S3 are executed repeatedly at least once until the lens module is formed, after the step S2 is executed for the first time and / or after the step S2 is repeatedly executed, a first annular shading piece is formed on each lens, and the first annular shading pieces are located in the plane areas and extend to cover a part of the curved surface area. According to the preparation method, the first annular shading pieces areembedded between the adjacent lenses, so that reflected stray light can be well shaded, and the phenomenon of glare or ghosting is avoided. In addition, the invention provides the lens module comprising the first annular shading pieces and a camera.

Description

technical field [0001] The invention relates to the technical field of cameras, in particular to a lens module, a preparation method thereof, and a camera. Background technique [0002] Wafer Level Optics (WLO) refers to optical components manufactured using wafer-level lens manufacturing technologies and processes. Different from the processing technology of traditional optical components, the WLO process uses semiconductor technology to replicate and process lens modules in batches on the entire wafer, presses multiple lens wafers together, and then cuts them into single lens modules. The WLO process is more suitable for mobile consumer electronics devices, especially in the case of complex structures at the 3D vision transmitter. Wafer-level optical components can effectively reduce the volume and space, and at the same time, the device has good consistency, light weight, low height, and high beam quality. , the use of semiconductor technology has a cost advantage after ...

AI Technical Summary

Problems solved by technology

When the incident light L1 enters the lens group 100 from the upper surface of the first lens 110, under certain incident angles, the reflection of the surface of the first lens 110 and / or the second lens 120 The light will be reflected multiple times inside the mirror group 100 and enter the sensing module 200, and the stray light generated by the reflection will cause such as figure 2 Flare or ghost phenomenon shown, resulting in reduced image quality

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