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Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using same

A technology of polyphenylene ether resin and composition, which is applied in the direction of metal layered products, applications, household appliances, etc., and can solve problems such as deterioration

Active Publication Date: 2020-05-01
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has gradually been found that the polyphenylene ether resin composition described in the above-mentioned Patent Document 1 is effective in flame retardancy, but on the other hand, it deteriorates low dielectric properties (especially, Df)

Method used

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  • Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using same
  • Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using same
  • Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～14、 comparative example 1～6

[0171] [Preparation]

[0172] (resin varnish)

[0173] First, each component was added to toluene at the compounding ratio described in Tables 1 and 2 so that the solid content concentration was 60% by mass, and mixed. This mixture was stirred for 60 minutes to obtain a varnish-like resin composition (varnish).

[0174] (Prepreg I)

[0175] Glass cloth (#1067 type, E glass manufactured by Asahi Kasei Co., Ltd.) was impregnated with the resin varnishes of Examples and Comparative Examples, and then heated and dried at 100 to 170° C. for about 3 to 6 minutes to obtain prepregs. At this time, the content of the resin composition was adjusted so as to be about 74 mass % with respect to the weight (resin content) of the prepreg.

[0176] (Prepreg II)

[0177] Glass cloth (#2116 type, E glass manufactured by Asahi Kasei Co., Ltd.) was impregnated with the resin varnishes of Examples and Comparative Examples, and then heated and dried at 100 to 170° C. for about 3 to 6 minutes to o...

Embodiment 15～16、 comparative example 7～8

[0207] Except having changed the compounding ratio of each component into the compounding ratio of Table 3, it carried out similarly to Example 1, and obtained the resin varnish of Examples 15-16 and Comparative Examples 7-8.

[0208] Using the obtained resin varnish, samples such as prepregs and metal foil-clad laminates similar to those in Example 1 were produced, and the same evaluation tests were carried out. The results are shown in Table 3.

[0209]

[0210] (investigation)

[0211] As can be seen from the results shown in Table 3, it has been shown that even if a modified polyphenylene ether different from that of Examples 1 to 14 is used, it is possible to provide The flame retardant (cyclic phosphazene compound) Comparative Examples 7 to 8 have excellent dielectric properties, flame retardancy, and heat resistance, and are excellent in formability and Tg compared to resin compositions.

[0212] This application is based on Japanese Patent Application No. 2017-166...

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Abstract

The present invention relates to a poly(phenylene ether) resin composition that comprises (A) a modified poly(phenylene ether) compound, which includes a terminal modified with a substituent having anunsaturated carbon-carbon double bond, (B) a crosslinking hardener having an unsaturated carbon-carbon double bond in the molecule, and (C) a flame retardant, characterized in that the flame retardant (C) comprises a modified cyclic phenoxyphosphazene compound represented by formula (I).

Description

technical field [0001] The present invention relates to a polyphenylene ether resin composition, a prepreg, a metal foil-clad laminate, a wiring board, and the like using the same. Background technique [0002] With regard to various electronic devices, in recent years, along with an increase in the amount of information processing, mounting technologies such as higher integration of mounted semiconductor devices, higher density of wiring, and multilayering have been rapidly developed. In order to increase the transmission speed of signals and reduce the loss during signal transmission, substrate materials constituting the substrates of printed circuit boards used in various electronic devices are required to have low dielectric constants and low dielectric loss tangents. [0003] It is known that polyphenylene ether (PPE) has excellent dielectric properties such as dielectric constant and dielectric loss factor, and its dielectric constant, dielectric Dielectric characteri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12B32B15/08C08K5/5399H05K1/03
CPCB32B15/08C08K5/5399C08L71/12C08L71/126C08J5/043C08J2371/12C08K5/5313C08K5/5397H05K2201/012H05K1/0373H05K1/0366B32B2457/08B32B2250/40B32B2264/104B32B5/26B32B2307/3065B32B2260/021B32B2307/732B32B2260/028B32B2262/0276B32B2307/204B32B2262/0269B32B15/20B32B2264/12B32B15/14B32B5/022B32B2260/046B32B2264/102B32B2262/101B32B2307/306B32B2250/03H05K1/0326H05K1/0353C08J5/244C08J5/249C08K5/0025C08K5/0066C08J5/04B32B2305/076C08J5/24C08L2201/02C08L2312/00
Inventor 铃木文人梅原大明安本洵井上博晴
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD