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Power module having features for clamping and power module assembly

A technology for power modules and clamping components, which is applied in the direction of electrical components, semiconductor devices, and electric solid-state devices, and can solve the problems of time-consuming installation of power modules, increased manufacturing costs of base plates and power modules, etc.

Pending Publication Date: 2020-05-01
DANFOSS SILICON POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, providing a fixed part significantly increases the cost of manufacturing the baseplate and power module
Further, each power module needs to be provided with several fixing parts to securely mount the power module to the substrate, and therefore, it is time-consuming to install the power module

Method used

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  • Power module having features for clamping and power module assembly
  • Power module having features for clamping and power module assembly
  • Power module having features for clamping and power module assembly

Examples

Experimental program
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Embodiment Construction

[0037] Exemplary embodiments of the present disclosure will hereinafter be described in detail with reference to the accompanying drawings, wherein like reference numerals designate like elements. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will be within the skill of the art personnel to fully convey the concepts of the disclosure.

[0038] image 3 and Figure 4 A power module in an embodiment of the disclosure is shown. The power module 200 includes a base plate 210 , electronic components 230 mounted on a top surface of the base plate 210 , and a body 220 encapsulating the electronic components 230 and the base plate 210 . like image 3 and Figure 4 As shown, a portion of the top surface of the chassis is exposed from the main body 220 and thus accessible from the outside. ...

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PUM

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Abstract

A power module (200) is disclosed. The power module (200) comprises: a base plate (210); an electronic component (230) mounted on a top surface of the base plate (210); and a body (220) encapsulatingthe electronic component (230) and the base plate (210). The body (220) is configured or designed such that a part of the top surface of the base plate (210) is externally accessible. A power module assembly comprising at least one power module (200) is also disclosed. The power module assembly further comprises: a substrate (400) on which the power module (200) is disposed; and at least one clamping device (300) configured for clamping on the part of the top surface of the base plate (210) and fixing the power module (200) to the substrate (400).

Description

technical field [0001] The present disclosure relates to an electrical device, and in particular, to a power module having a clamping feature, a power module assembly, and an electrical device including the power module. Background technique [0002] Customers are placing more and more electrical and mechanical requirements on industrial and automotive applications. Power modules are used in different kinds of electrical installations. In electrical devices such as inverters, the space for molding power modules is getting smaller and smaller. [0003] Conventionally, the power module is fixedly mounted on the substrate by fixing members such as screws or bolts. Usually, the fixing member needs to pass through the corresponding fixing part of the power module to fix the power module on the substrate. The fixed part takes up space, so that more space is required in the electrical installation. Furthermore, these fixing parts make it impossible to arrange the power modules ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L25/11H01L23/498H01L25/18H01L23/28H01L25/16
CPCH01L25/072H01L25/115H01L25/18H01L25/16H01L23/49844H01L23/3121H01L2924/13055H01L2924/13091H01L2924/19105H01L2924/3511
Inventor 霍尔格·比尔拉尔斯·保罗森
Owner DANFOSS SILICON POWER