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Semiconductor devices having electro-optical substrates

A substrate, electro-optic technology, applied in the coupling of light guides, optical waveguides, optics, etc., can solve the problems of expensive optical transceivers and increase the cost of operating data centers

Active Publication Date: 2020-05-05
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such optical transceivers can be relatively expensive
However, at high data bandwidths, electrical signals in conductive cables or traces can travel only small distances until additional repeater chips are required to boost the signal
Such repeater chips consume additional power—adding to the cost of operating data centers, high-performance computers, or other devices that contain many interconnected memory devices

Method used

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  • Semiconductor devices having electro-optical substrates
  • Semiconductor devices having electro-optical substrates
  • Semiconductor devices having electro-optical substrates

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Embodiment Construction

[0017] Specific details of several embodiments of semiconductor devices including electro-optical substrates and associated systems and methods are described below with reference to FIGS. 1-6 . In several of the described embodiments, a semiconductor device such as a memory device (e.g., a dual inline memory module (DIMM)) includes an electro-optic substrate comprising a circuit board (e.g., a printed circuit board) ) on polymer waveguides. The electro-optic substrate can carry a plurality of memories, and the memories can be electrically coupled to a circuit board and optically coupled to a polymer waveguide. The memory may be configured to receive power via the circuit board, and to receive, transmit, or both receive and transmit optical signals (eg, data signals) via the polymer waveguide.

[0018] Accordingly, a memory device in accordance with the present techniques may include an integrated waveguide or other optical layer that provides an optical input / output (I / O) int...

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Abstract

Memory devices having electro-optical substrates are described herein. In one embodiment, a memory device includes a plurality of memories carried by an electro-optical substrate. The electro-opticalsubstrate can include a circuit board and an optical routing layer on the circuit board. The memories can be (a) electrically coupled to the circuit board and (b) optically coupled to the optical routing layer. In some embodiments, the optical routing layer is a polymer waveguide.

Description

[0001] Cross References to Related Applications [0002] This application contains a concurrent application to Omar J. Bchir entitled "SEMICONDUCTOR PACKAGES HAVING PHOTON INTEGRATED CIRCUIT (PIC) CHIPS" Related subject matter of the US patent application. The related application is assigned to Micron Technology, Inc. and identified by Attorney Docket No. 010829-9351.US00, the disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates generally to semiconductor devices with optical interfaces, and more particularly to memory devices including electro-optic substrates. Background technique [0004] A memory package or module typically contains multiple memory devices mounted on a substrate. Memory devices are widely used to store information related to various electronic devices (eg, computers, wireless communication devices, cameras, digital displays, etc.). Information is stored by programming different states of memo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C7/10G11C5/04
CPCG11C7/1051G11C7/1078G11C5/04G02B6/43G11C5/063G11C7/1081G11C7/1054G02B6/12004G02B6/1225G02B6/428G11C11/401G02B6/30
Inventor O·J·贝希尔
Owner MICRON TECH INC