Carrier for wafer loading and carrier clamping device

Abstract

The invention relates to the technical field of integrated circuit production equipment, and discloses a carrier for wafer loading and a carrier clamping device. The carrier comprises a wafer carrierfor loading a wafer, a first clamping plate and a second clamping plate, wherein the first clamping plate and the second clamping plate can move relatively, and the first clamping plate and the secondclamping plate are installed on a driving structure of a manipulator. According to the carrier for wafer loading and the carrier clamping device, a control bag is in an expansion state in a non-clamping state, an accommodating groove is completely plugged and not easy to accommodate external particulates, particles are prevented from flying out at the same time, and contamination of the wafer isavoided; the root of a positioning block is tightly held by the expansion of a clamping bag in a clamping state, the friction force between the clamping device and the carrier is improved, slipping and rotating are avoided in the clamping process, and the position is kept fixed; the requirement for the matching degree between the positioning block and the accommodating groove of the control bag islowered, the positioning block can still be easily inserted into the accommodating groove under the condition that the position is not greatly changed, and the positioning requirement for clamping amoving device is lowered.

Description

technical field [0001] The invention relates to the technical field of integrated circuit production equipment, in particular to a carrier for wafer loading and a carrier clamping device. Background technique [0002] Due to the characteristics of thinness and brittleness, the wafer usually needs to be installed on the wafer carrier and further loaded in the carrier box. With the progress of the production process, the wafer is developing in the direction of thinner and larger. Please refer to Figure 5 , for larger size wafers, due to the increase in mass and decrease in thickness, in order to ensure that the manipulator can smoothly clamp the wafers in and out of the carrier box, a matching engaging part is provided on the clamping part and the carrier, increasing Capacity in the vertical direction. [0003] With the advancement of technology, the cost of a single wafer is getting higher and higher. Although the above structure can improve the stability of the manipulator ...

AI Technical Summary

Problems solved by technology

[0003] With the advancement of technology, the cost of a single wafer is getting higher and higher. Although the above structure can improve the stability of the manipulator holding the wafer carrier in and out of the carrier box, the notch will naturally collect particles, which is easy to contaminate the wafer. Reduce the yield rate of wafers. On the other hand, if the clamping mismatch is high, it is necessary to have higher requirements for the clamping position when clamping, and the wafers are placed in the wafer box for a long time. The relative positions of the clamping parts are not exactly the same, the clamping operation is more difficult, and the matching degree is low, that is, the clamping groove is much larger than the clamping block, and the clamping angle of the wafer is easy to change, and it is very difficult to enter and exit the carrier box. Prone to collision, damage the wafer

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