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Probe type film thermocouple and preparation method thereof

A probe-type, thermocouple technology, applied in the manufacture/processing of thermoelectric devices, thermoelectric device components, thermoelectric device node lead-out materials, etc., can solve the problems of no disclosure and achieve easy packaging and installation, volume Tiny, easy-to-operate effects

Active Publication Date: 2020-05-12
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In aero-engine design and verification experiments, in order to verify the combustion efficiency of the engine and the design of the cooling system, it is necessary to accurately test the temperature of the engine turbine blade surface, the inner wall of the combustion chamber, etc., so it is necessary to involve a temperature measurement suitable for the high-temperature flow field environment device, however there is no similar disclosure in the prior art

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  • Probe type film thermocouple and preparation method thereof
  • Probe type film thermocouple and preparation method thereof
  • Probe type film thermocouple and preparation method thereof

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Embodiment Construction

[0029] The present invention is described in further detail below in conjunction with accompanying drawing:

[0030] refer to Figure 1 to Figure 4 , the probe type thin film thermocouple of the present invention comprises a columnar substrate 1, a tungsten-rhenium 26 thin film region 2 and an indium oxide thin film region 3, and the side of the columnar substrate 1 is provided with a first straight groove and a second straight groove, wherein the tungsten The rhenium 26 thin film region 2 is distributed on the front end surface of the columnar substrate 1 and in the first straight groove, and the indium oxide thin film region 3 is distributed on the front end surface of the columnar substrate 1 and in the second straight groove, and is located on the front end surface of the columnar substrate 1. The indium film area 3 is connected with the tungsten-rhenium 26 film area 2, the first metal lead 4 is connected with the tungsten-rhenium 26 film area 2, the second metal lead is c...

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Abstract

The invention discloses a probe type film thermocouple and a preparation method thereof. The film thermocouple comprises a columnar substrate, a tungsten-rhenium 26 thin film region and an indium oxide thin film region. A first straight groove and a second straight groove are formed in the side surface of the columnar substrate; wherein the tungsten-rhenium 26 thin film region is distributed on the front end surface of the columnar substrate and in the straight groove; the indium oxide thin film region is distributed on the front end surface of the columnar substrate and in the second straightgroove; and the indium oxide thin film region located on the front end surface of the columnar substrate is connected with the tungsten-rhenium 26 thin film region, the first metal lead is connectedwith the tungsten-rhenium 26 thin film region, and the second metal lead is connected with the indium oxide thin film region, so that the thermocouple can realize temperature measurement in a high-temperature flow field environment, and the preparation method is simple.

Description

technical field [0001] The invention belongs to the technical fields of sensor design and preparation and high-temperature temperature measurement, and relates to a probe-type film thermocouple and a preparation method thereof. Background technique [0002] In the aero-engine design and verification experiments, in order to verify the combustion efficiency of the engine and the design of the cooling system, it is necessary to accurately test the temperature of the engine turbine blade surface, the inner wall of the combustion chamber, etc., so it is necessary to involve a temperature measurement suitable for the high-temperature flow field environment device, however, there is no similar disclosure in the prior art. Contents of the invention [0003] The purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art, and provide a probe-type thin-film thermocouple and a preparation method thereof. The thermocouple can realize temperature ...

Claims

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Application Information

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IPC IPC(8): G01K7/02G01K1/00H01L35/32H01L35/34
CPCG01K7/02G01K1/00H10N10/01H10N10/17G01K1/08H10N10/81H10N10/85
Inventor 田边刘延刘兆钧张仲恺刘江江汪存峰史鹏林启敬蒋壮德
Owner XI AN JIAOTONG UNIV