Wet unsealing method for plastic package device

Abstract

The invention discloses a wet unsealing method for a plastic package device. The wet unsealing method comprises the following steps of: polishing the surface of the package body of the plastic packagedevice by using fine sandpaper or a grinding tool to destroy a surface oil film; using an organic solvent for cleaning the packaging body, and removing residues attached to the surface of the packaging body; baking the plastic package device to volatilize the residual organic solvent on the surface of the package body; uniformly spraying aluminum powder on the surface of the packaging body, and forming an aluminum film after baking and hardening; etching the unsealed position of the packaging body by using laser etching, and removing the aluminum film on the surface of the packaging body to form a corrosion window; and putting the plastic package device into fuming nitric acid for corrosion; observing the depth of a groove appearing in the corrosion window, taking out the plastic packagedevice after the internal chip is exposed, cleaning and drying the plastic package device. The technical problems that the package body of the plastic package device is corroded by concentrated acid,due to the fact that concentrated acid corrosion is uniform corrosion in all directions and cannot be used for directional corrosion, in the unsealing process, excessive corrosion is often caused by process deviation, the internal structure of the plastic package body is damaged, and the unsealing effect is affected are solved.

Description

technical field [0001] The invention belongs to the unsealing technology of plastic-encapsulated devices, in particular to a wet-unsealing method for plastic-encapsulated devices. Background technique [0002] Wet unsealing of plastic-encapsulated devices is an unsealing method that uses concentrated acid to corrode the plastic-encapsulated device package to expose the chip structure inside the package. Excessive corrosion will cause damage to the internal structure of the plastic package and affect the unsealing effect. Invention content: [0003] The technical problem to be solved by the present invention is to provide a wet unsealing method for plastic-encapsulated devices to solve the unsealing method in the prior art that uses concentrated acid to corrode the plastic-encapsulated device package and expose the chip structure inside the package. In the process of unsealing, process deviations often lead to excessive corrosion, resulting in damage to the internal struct...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a wet unsealing method for plastic-encapsulated devices to solve the unsealing method in the prior art that uses concentrated acid to corrode the plastic-encapsulated device package and expose the chip structure inside the package. Uniform corrosion, unable to directional corrosion, in the process of unsealing, process deviation often leads to excessive corrosion, resulting in damage to the internal structure of the plastic package, affecting technical problems such as unsealing effect