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TO packaged TOSA and optical module

An optical module and laser technology, applied in the field of optical communication, can solve problems such as energy inability to transfer, and achieve the effect of reducing capacitor energy storage and eliminating hazards.

Active Publication Date: 2020-05-22
SOURCE PHOTONICS CHENGDU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual use, it is found that there is a potential difference between the two brackets, and then a capacitance is formed between the two brackets, which forms a capacitive-inductive resonance with the inductance of the gold wire on the two carriers, so that the energy at certain frequency points cannot be transmitted between the two carriers

Method used

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  • TO packaged TOSA and optical module
  • TO packaged TOSA and optical module
  • TO packaged TOSA and optical module

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0016] see Figure 1-2 , the TOSA packaged TOSA pro...

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Abstract

The invention relates to a TO packaged TOSA and an optical module. The TO packaged TOSA comprises a laser chip, a tube socket, two supports, two carriers and a semiconductor refrigerator, wherein thetwo supports are respectively used for supporting a carrier and conducting heat, the carrier is used for transmitting signals and supporting a laser chip, one support is installed on a semiconductor refrigerator, the other support II is directly installed on a tube socket, and the two supports are connected through two wires. The TOSA provided by the invention can effectively reduce the capacitance problem between the two brackets, and further can eliminate the harm of a resonance phenomenon.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a TOSA packaged by TO and an optical module. Background technique [0002] An optical module is a device that can convert optical signals into electrical signals and convert electrical signals into optical signals. TOSA is an essential part of the optical module and is used to send out laser signals. Since most optical modules are installed outdoors, the high temperature and high humidity environment will seriously affect the transmission of optical signals, so TO packaging is generally used to solve the high airtightness requirements of laser chips. can refer to figure 1 , The TOSA packaged in TO includes a laser chip, a tube base, a bracket, a carrier, and a semiconductor cooler (TEC). The two brackets are used to support the carrier and conduct heat, and the carrier is used to transmit signals and support the laser. The first bracket is installed on the semicon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S5/024
CPCH01S5/02415H01S5/02476H01S5/0231H01S5/02345
Inventor 易利陈雯
Owner SOURCE PHOTONICS CHENGDU