Front and back buckle stacked high-density server assembly structure and high-density server

Abstract

The invention discloses an assembly structure of a stacked high-density server with positive and negative buckles and a high-density server, wherein the assembled structure includes a heat dissipation component and at least a pair of upper and lower main boards which are stacked and connected by positive and reverse buckles, the bottom surface of the upper main board, and the lower main board Microprocessors and memory sticks are arranged on the top surface of each, the microprocessors of the upper motherboard and the lower motherboard are relatively arranged, and the cooling assembly includes a radiator arranged between the microprocessors of the upper motherboard and the lower motherboard. The present invention stacks and assembles two completely identical server main boards with positive and negative buckles, and the shared radiator between the microprocessors of the upper main board and the lower main board makes the overall space after assembly still occupy the original unit space occupied by one server main board , can effectively solve the idle space existing in the traditional thinking of server assembly structure design, double the hardware resources in the same space, further improve server performance, and ensure effective and reliable heat dissipation requirements at the same time.

Description

technical field [0001] The invention relates to the field of hardware structure design of high-density servers, in particular to a front-to-back buckle stacked high-density server assembly structure and a high-density server. Background technique [0002] At present, in the standard specifications of hardware structure design, the commonly used standard board types of server motherboards mainly include ITX (170mm*170mm), MATX (244mm*244mm), ATX (305mm*244mm), EATX (305mm*330mm), EE-ATX (347mm*330mm) and other specifications, and the height direction of the hardware structure design is in the standard with U as the unit, 1U=44.45mm. In the traditional design, in the overall structure of the server with nU as the unit height, there is generally only one layer of server motherboards that can be assembled in the space per unit height, and the hardware configuration is expanded horizontally without vertical expansion. Since the heights of processors, memory sticks, and various d...

AI Technical Summary

Problems solved by technology

In this way, although the heat dissipation problem can be solved, the overall space utilization rate of the server system is not high, and there are still idle spaces.

Images