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A kind of FPC pad hole manufacturing method and FPC product

A manufacturing method and pad hole technology, applied in printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of complex process, high cost, difficult processing technology, etc., and achieve the effect of simple process and low cost

Active Publication Date: 2021-06-29
XIAMEN BOLION CIRCUIT
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This processing technology is difficult, costly and complicated

Method used

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  • A kind of FPC pad hole manufacturing method and FPC product
  • A kind of FPC pad hole manufacturing method and FPC product
  • A kind of FPC pad hole manufacturing method and FPC product

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Embodiment Construction

[0027] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0028] Such as figure 1 Shown to 8, a kind of FPC pad hole manufacturing method, it may comprise the following steps:

[0029] S1. Use laser ablation to conduct controlled-depth drilling from the back of the pad to ablate the copper layer 3 on the back and the base material 4, and keep the copper layer (or front copper layer) 5 on the pad from being ablated. The laser process here uses a UV laser, and the laser spot diameter is about 25 microns. In order to ensure the coincidence of the laser lines, it is first necessary to fill the grid in the hole 2 to be laser ablated (such as Figure 3a ) or ring lines, followed by laser ablation on the network or ring lines. Preferably, the distance between network lines or ring lines is set to 20 microns.

[0030] Here, the laser ablation of the reverse copper layer 3 and the substrate 4 adopts focused and...

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Abstract

The invention discloses a method for manufacturing an FPC pad hole, which comprises the following steps: S1. Using laser ablation to conduct depth-controlled drilling on the back side of the pad to ablate the copper layer and base material on the back side, and retain the copper on the pad surface The layer is not ablated; S2. The copper layer on the reverse side and the copper layer on the pad surface are conducted through the copper plating process. The invention also discloses an FPC product with pad holes made by the above-mentioned method. Compared with the existing pad hole manufacturing method, the pad hole manufacturing method of the present invention has simpler process and lower cost, and greatly reduces the defect rate of products and improves the reliability of products.

Description

technical field [0001] The invention relates to the field of FPCs, in particular to a method for manufacturing FPC pad holes and FPC products. Background technique [0002] Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. Referred to as soft board or FPC, it has the characteristics of high wiring density, light weight, and thin thickness. With the miniaturization design of FPC products, the wiring density of products is also increased. Some FPC products design the via hole 2 on the pad 1, such as Figure 2a and 2b shown. in Figure 2a shows the front line of the product, Figure 2b Shows the reverse side of the product. This will cause the center of the pad surface to be hollow, the soldering area will become smaller, and soldering defects such as virtual soldering and false soldering will easily occur, resulting in a decrease in product yield and poor soldering reli...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0026H05K3/42
Inventor 王文宝洪诗阅洪超育
Owner XIAMEN BOLION CIRCUIT