Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate processing equipment and substrate processing method

A substrate processing method and substrate technology, which are applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as time-consuming and errors, and achieve the effect of saving human resources and avoiding mistakes.

Active Publication Date: 2020-06-23
SCIENTECH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such manual work is not only time-consuming, but sometimes errors may even occur due to human factors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing equipment and substrate processing method
  • Substrate processing equipment and substrate processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0022] Please see figure 1 , which illustrates a substrate processing apparatus 100 by which substrate wet processing (possibly including, for example, etching, cleaning, drying operations, etc.) can be performed according to an embodiment of the present invention. The apparatus 100 illustrated comprises a treatment device 110 , a supply device 120 , a cleaning device 130 and a control device 140 electrically connected to the treatment device 110 , the supply device 120 and the cleaning device 130 .

[0023] According to one embodiment, the processing device 110 has a chamber and is configured to receive at least one substrate 150 to be processed in the chamber. According to some embodiments, the processing performed by the processing device 110 on the substrate 150 may be related to single-substrate wet process, multi-substrate wet process, metal un...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses substrate processing equipment, which includes a treatment device, a supply device, a cleaning device and a control device, wherein the control device is configured to instructa switching element of the supply device to switch from a first configuration to a second configuration to change a reservoir for supplying a treatment fluid when a first parameter reaches a first condition; and the control device is further configured to instruct the cleaning device to provide a cleaning fluid into the treatment device for cleaning the treatment device when a second parameter reaches a second condition. The invention further provides a substrate processing method. By means of the substrate processing equipment and the substrate processing method, related human resources canbe saved, and the operation efficiency is improved.

Description

technical field [0001] The invention relates to a manufacturing process of a semiconductor device, in particular to a technology for processing a substrate with a processing liquid. Background technique [0002] Processes for semiconductor devices may use processing fluids to process substrates. For example, a wet etch operation may use acid as an etchant to create a pattern on a substrate. The processing liquid is generally stored in the storage tank of the liquid supply device and delivered to the substrate as required. In order to maintain the stability and correctness of the process, the storage tank of the liquid supply device must be manually replaced at regular intervals, and the processing facilities must also be manually cleaned at regular intervals. However, such manual work is not only time-consuming, but sometimes errors may even occur due to human factors. Contents of the invention [0003] It is an object of the present invention to provide a substrate pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67023H01L21/67276
Inventor 陈赞吉林志杰林世佳赖仁斌
Owner SCIENTECH