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Method of manufacturing conductive pattern

一种导电图案、金属图案的技术,应用在制备导电图案领域,能够解决印刷图案清晰度和电导率负面影响、基材变形、NIR烧结效率降低等问题

Inactive Publication Date: 2020-06-26
AGFA GEVAERT NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the efficiency of NIR sintering is often reduced when using transparent substrates
In addition, substrate deformation may occur when the glass transition temperature (Tg) of the substrate is lower than the temperature reached during NIR sintering
As a result, the clarity and conductivity of the printed pattern may be negatively affected
[0014] Another problem when using different substrates on which the conductive pattern is applied, for example by inkjet printing, is the dependence of the printing resolution on the substrate used

Method used

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  • Method of manufacturing conductive pattern
  • Method of manufacturing conductive pattern

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Experimental program
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preparation example Construction

[0223] Preparation of Metal Nanoparticle Dispersions

[0224] The preparation of metal nanoparticle dispersions (e.g., silver inkjet inks) typically involves mixing a liquid carrier, preferably a dispersion stabilizing compound, and optionally additives by using homogenization techniques (e.g., stirring, high shear mixing, sonication, or combinations thereof). added to the metal nanoparticles.

[0225] Silver nanoparticles for making silver inkjet inks are usually pastes or highly concentrated dispersions of silver nanoparticles.

[0226] A preferred method for the preparation of metal nanoparticles is disclosed in EP-A 2671927 .

[0227] It has been observed that better results are obtained when all or part of the dispersion stabilizing compound is added during the preparation process of the silver nanoparticles. Due to their adsorption onto the silver nanoparticles, dispersion stabilizing compounds added during the preparation of the silver nanoparticles will at least pa...

Embodiment 1

[0326] Five different substrates S-01 to S-05 were prepared by printing five different receiver layers according to Table 4 on Autotex Velvet 150 polyester with an Anapurna M2540i FB (BULB) printer (from Agfa).

[0327] Using a Konica Minolta 30 pL print head (KM1024iLHE) (E fab = 14 µm, E shift = 35 µm) on a Ceraprinter (from MGI ceradrop), silver squares (2 cm × 2 cm) were printed on the receiver layer of each substrate with silver inkjet ink AgInk-01.

[0328] All samples were sintered by using Adphos NIR lamps (100% power, but at different NIR sintering speeds) according to Table 6.

[0329] The conductivity and adhesion of the silver patterns are shown in Table 7.

[0330] Table 6

[0331] Substrate receiving layer S-01 G5 Color (K=75%, C=M=Y=75%) S-02 G5 Color (Y =100%) S-03 G5 Color (M =100%) S-04 G5 Color (C =100%) S-05 G4 white

[0332] Table 7

[0333] example Substrate NIR sintering speed (mm / s) Sh...

Embodiment 2

[0338] Substrates S-06 to S-14 were prepared by printing the white ink according to Table 8 on Autotex Velvet 150 polyester.

[0339] Using the printing conditions according to Table 8, S-06 to S-11 were prepared by printing white ink on one side of the polyester with a single-pass Microcraft printer.

[0340] S-12 and S-13 were prepared by inkjet printing white ink on one side of the polyester using an Anapurna M2540i FB (BULB) printer (from Agfa) in multi-pass mode.

[0341] S-14 was prepared by drawing down white ink on one side of the polyester as above.

[0342] Using a Konica Minolta 30 pL printhead (KM1024iLHE) (E fab = 14 µm, E shift =35 µm) on a Ceraprinter (from MGI ceradrop), silver squares (2 cm × 2 cm) were printed on the receiving layer of each substrate with silver inkjet ink AgInk-01, and a NIR lamp (100% power, 10 mm / s platform speed) for sintering.

[0343] Table 8

[0344] Substrate white ink printing conditions S-06 Wh04 720×72...

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Abstract

A method of preparing a conductive pattern on a substrate comprising the steps of applying a receiving layer (200) on a substrate (100), applying a metallic nanoparticle dispersion on the receiving layer thereby forming a metallic pattern (300), and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75 [mu]m.

Description

[0001] field of invention [0002] The present invention relates to methods for producing conductive patterns on various substrates. [0003] Background of the invention [0004] Over the past few decades, interest in metal printing or coating fluids containing metal nanoparticles has increased due to their unique properties compared to the bulk properties of a given metal. For example, the melting point of metal nanoparticles decreases with decreasing particle size, making them of interest for printed electronics, electrochemical, optical, magnetic and biological applications. [0005] The production of stable and concentrated metal printing or coating fluids, which can be printed eg by inkjet printing, or coated at high speed, is of great interest because it enables the production of electronic devices at low cost. [0006] Metal printing or coating fluids are typically metal nanoparticle dispersions comprising metal nanoparticles and a dispersion medium. This metal nanopar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09C09D11/52H05K3/12H05K3/38
CPCC09D11/101C09D11/322C09D11/40C09D11/52H05K1/097H05K3/125H05K3/386H05K2201/0108H05K2201/0145H05K2201/0175H05K2201/0209H05K2203/013H05K2203/1131H05K2203/125B41M3/006B41M5/0047C09D11/037C09D11/107C09D11/54H05K3/4644
Inventor F.科尔特斯萨拉查K.斯蒂尔特V.柯迪特K.范登博舍W.吉尔伯特G.达勒曼P.维拉尔特
Owner AGFA GEVAERT NV