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Resin composition, semiconductor sealing material, one-part adhesive and adhesive film

A technology of resin composition and epoxy resin, which is applied in the direction of non-polymer adhesive additives, adhesive types, semiconductor devices, etc., can solve the problems of low fluidity, high viscosity, and unevenness of semiconductor sealants. Achieve good storage stability

Pending Publication Date: 2020-06-30
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, silica fillers are prone to agglomeration, non-uniformity, and high viscosity in semiconductor encapsulants
As a result, the fluidity of the semiconductor encapsulant becomes low, making it difficult to further improve moldability

Method used

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  • Resin composition, semiconductor sealing material, one-part adhesive and adhesive film
  • Resin composition, semiconductor sealing material, one-part adhesive and adhesive film
  • Resin composition, semiconductor sealing material, one-part adhesive and adhesive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～17

[0079] (Examples 1-17, Comparative Examples 1-8)

[0080] After mixing and dispersing each component with a hybrid mixer (hybrid mixer) so that it may become the compounding ratio shown in the following table|surface, vacuum defoaming was performed, and the resin composition for evaluation was prepared. In addition, the numerical value concerning each composition in a table|surface is shown by mass part. In addition, as the silica filler of the (C) component, samples treated as follows: after surface treatment with an alkaline substance or after surface treatment with a silane coupling agent, were further mixed at 150° C. Heat treatment was performed for 4 hours as preliminary drying.

[0081] (A) epoxy resin

[0082] (A1) Bisphenol F-type epoxy resin (product name EXA835LV, manufactured by DIC Corporation, epoxy equivalent 165)

[0083] (A2) aminophenol type epoxy resin, product name jER630, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 94)

[0084] (B...

Embodiment 1

[0113] Example 1 is an example using 3MOPA (pKa=10.49) as an alkaline substance having a pKa of 9.4 or more for surface treatment of the silica filler of the component (C).

Embodiment 2

[0114] Example 2 is an example of using DBU (pKa=12.5) as an alkaline substance having a pKa of 9.4 or more used for the surface treatment of the silica filler of the component (C).

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Abstract

The purpose of the present invention is to improve storage stability of a resin composition used for applications such as semiconductor sealing materials. Provided is a resin composition, comprising:(A) epoxy resin; (B) a curing agent; and (C) a silica filler, wherein the silica filler as the component (C) is surface-treated with a basic substance having an acid dissociation constant (pKa) of a conjugate acid of 9.4 or higher. The resin composition further comprises a silane coupling agent (D), or the silica filler as the component (C) is further surface-treated with a silane coupling agent.

Description

technical field [0001] The present invention relates to a resin composition used, for example, as a semiconductor sealing agent, a one-component adhesive used in the manufacture of electronic parts, and an adhesive film used as an NCF (non-conductive film) when mounting a semiconductor. (NonConductive Film)). Background technique [0002] Along with miniaturization, weight reduction, and high performance of electronic equipment, the mounting form of semiconductors is changing from the wire-bonding type to the flip-chip type. A flip-chip type semiconductor device has a structure in which an electrode portion on a substrate and a semiconductor element are connected via bump electrodes. In the semiconductor device with this structure, when a thermal load such as a temperature cycle is applied, due to the difference in thermal expansion coefficient between the substrate made of an organic material such as epoxy resin and the semiconductor element, stress is applied to the bump ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08G59/50C08K3/013C08K3/36C08K5/5425C08K5/5435C08K9/06C09C1/30C09C3/12C09J7/30C09J11/04C09J11/06C09J163/00C09J163/02H01L21/60H01L23/29H01L23/31
CPCC08K3/013C08K3/36C08K5/5425C08K5/5435C08K9/06C09C1/30C09C3/08C09C3/12C09J163/00H01L23/295C08L63/00C09J7/10C09J2301/408C09J2203/326C09J2463/00C08K9/04C08K5/54C08G59/50C08G59/5073C09J11/04C09J11/06C09J7/00C09J7/30C08K5/17C08K2201/005C09C1/3063C08K5/5415
Inventor 梶田昌志佐藤文子
Owner NAMICS CORPORATION