Halogen-free lead-free soldering paste and preparation method thereof

A halogen-free lead-free solder paste and a technology for solder paste, applied in the field of halogen-free lead-free solder paste and its preparation, can solve the problems of environmental pollution, poor stability, uneven spot coating, etc., achieve good compatibility, reduce surface tension, Solving the effect of poor wetting performance

Active Publication Date: 2020-07-03
SHENZHEN BANGDA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when it is used, it will be unevenly coated, accompanied by the generation of tin beads
Moreover, its stability is relatively poor
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Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A halogen-free lead-free solder paste, including solder alloy powder and flux, and the weight ratio of the solder alloy powder to the flux is 88:12;

[0030] The flux is made of the following raw materials in parts by weight: 80 parts of rosin, 50 parts of compound solvent, 16 parts of organic acid, 8 parts of hydrogenated castor oil, 13 parts of glycerol, 6 parts of palmitic acid, 7 parts of organic amine, 10 parts of quinoline-2-carboxylic acid, 8 parts of antioxidant, 5 parts of glyceryl stearate, 12 parts of active agent and 16 parts of surfactant.

[0031] The solder alloy powder is 98.5Sn / 1.0Ag / 0.5Cu; the particle size of the solder powder is 20-35 μm.

[0032] Rosin is a mixture of hydrogenated rosin and polymerized rosin; wherein the weight ratio of hydrogenated rosin to polymerized rosin is 1:2.

[0033] The compound solvent is made by mixing 2-butanol, propylene glycol and ethylene glycol monoethyl ether in a mass ratio of 2:6:1.

[0034] The organic acid is succinic a...

Embodiment 2

[0046] A halogen-free lead-free solder paste, comprising solder alloy powder and flux, and the weight ratio of the solder alloy powder to the flux is 89:11;

[0047] The flux is made from the following raw materials in parts by weight: 90 parts of rosin, 60 parts of compound solvent, 18 parts of organic acid, 10 parts of hydrogenated castor oil, 15 parts of glycerol, 10 parts of palmitic acid, 8 parts of organic amine, 12 parts of quinoline-2-carboxylic acid, 13 parts of antioxidant, 8 parts of glyceryl stearate, 15 parts of active agent and 20 parts of surfactant.

[0048] The solder alloy powder is 95.4Sn / 3.1Ag / 1.5Cu; the particle size of the solder powder is 20-35 μm.

[0049] Rosin is a mixture of hydrogenated rosin and polymerized rosin; wherein the weight ratio of hydrogenated rosin to polymerized rosin is 1:3.

[0050] The compound solvent is a mixture of 2-butanol, propylene glycol and ethylene glycol monoethyl ether in a mass ratio of 2:7:1.5.

[0051] The organic acid is glut...

Embodiment 3

[0063] A halogen-free lead-free solder paste, comprising solder alloy powder and flux, and the weight ratio of the solder alloy powder to the flux is 90:10;

[0064] The flux is made from the following raw materials in parts by weight: 95 parts of rosin, 70 parts of compound solvent, 20 parts of organic acid, 13 parts of hydrogenated castor oil, 20 parts of glycerol, 12 parts of palmitic acid, 12 parts of organic amine, 15 parts of quinoline-2-carboxylic acid, 16 parts of antioxidant, 10 parts of glyceryl stearate, 16 parts of active agent and 24 parts of surfactant.

[0065] The solder alloy powder is 99.0Sn / 0.3Ag / 0.7Cu; the particle size of the solder powder is 20-35 μm.

[0066] Rosin is a mixture of hydrogenated rosin and polymerized rosin; wherein the weight ratio of hydrogenated rosin to polymerized rosin is 1:4.

[0067] The compound solvent is made by mixing 2-butanol, propylene glycol and ethylene glycol monoethyl ether in a mass ratio of 2:8:2.

[0068] The organic acid is su...

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Abstract

The invention relates to the technical field of soldering paste preparation, in particular to a halogen-free lead-free soldering paste and a preparation method thereof. The halogen-free lead-free soldering paste comprises welding flux alloy powder and soldering flux in a weight ratio of (88-90) to (12-10); the soldering flux is prepared from the following raw materials in parts by weight: 80-95 parts of rosin, 50-70 parts of a compound solvent, 16-20 parts of organic acid, 8-13 parts of hydrogenated castor oil, 13-20 parts of glycerol, 6-12 parts of palmitic acid, 7-12 parts of organic amine,10-15 parts of quinolone-2-carboxylic acid, 8-16 parts of an anti-oxidant, 5-10 parts of glyceryl stearate, 12-16 parts of an active agent and 16-24 parts of a surfactant. The soldering paste preparedby the preparation method has the advantages of being uniform in point-coating, and free of soldering balls during welding, and further has the characteristics of stable performance and excellent welding performance. The soldering paste also meets welding use requirements, is excellent in performances, is environmentally friendly, is halogen-free and lead-free, and can be widely applied to electronic assembly and encapsulation of the electronic welding field.

Description

Technical field [0001] The invention relates to the technical field of solder paste preparation, in particular to a halogen-free lead-free solder paste and a preparation method thereof. Background technique [0002] Solder paste is also called solder paste, gray paste. Solder paste is a new type of soldering material that emerges with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. Mainly used in the soldering of electronic components such as PCB surface resistance, capacitors, and ICs in the SMT industry. [0003] Solder paste is a new type of soldering material that came into being with SMT. Solder paste is a complex system, which is a mixture of solder powder, flux and other additives. The solder paste has a certain viscosity at room temperature, which can initially stick the electronic components to the predetermined position. At the soldering temperature, with the volatilization of the solvent and some additives...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/025B23K35/262B23K35/3612B23K35/362
Inventor 梁凯
Owner SHENZHEN BANGDA TECH CO LTD
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