Fan-out wiring structure and display panel
A wire structure and wire routing technology is applied in the field of fan-out wire structure and display panel, which can solve the problem that the frame of the display panel cannot be extremely narrowly compressed, and achieve the effect of compressing the height.
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Embodiment 1
[0051] Such as Figure 6 As shown, this embodiment provides a fan-out routing structure, which has a first fan-out routing 100, wherein one end of the fan-out routing is connected to a bonding terminal (bonding pad) 10 of a driving circuit board, and the other end of the fan-out routing Connect to the access terminal 20 of the TFT array area. The first fan-out routing 100 includes a first routing 1, a second routing 2, and a third routing 3, the second routing 2 is arranged above the first routing 1 and arranged alternately with the first routing 1, The third trace 3 is correspondingly arranged above the second trace 2 and the projection on the first trace 1 completely falls within the range of the first trace 1 . In other words, the first wiring 1 and the second wiring 2 are arranged alternately, and the vertical projection of the third wiring 3 on the first wiring 1 overlaps with the first wiring 1 .
[0052] Such as Figure 7 As shown, when the third trace 3 is correspon...
Embodiment 2
[0063] Such as Figure 8 As shown, this embodiment provides a fan-out routing structure, which has a second fan-out routing 200, wherein one end of the fan-out routing is connected to a bonding terminal (bonding pad) 10 of a driving circuit board, and the other end of the fan-out routing Connect to the access terminal 20 of the TFT array area. The second fan-out routing 200 includes a first routing 1, a second routing 2 and a third routing 3, the second routing 2 is arranged above the first routing 1 and partially overlaps the first routing 1, The third routing 3 is disposed above the second routing 2 and partially overlaps the second routing 2 .
[0064] Such as Figure 9 As shown, when the third wiring 3 is arranged above the second wiring 2 and partially overlaps the second wiring 2, the second fan-out wiring 200 also includes a second substrate 210, a second insulating layer 220, a second The passivation layer 230 and the fifth passivation layer 240 .
[0065] The seco...
Embodiment 3
[0075] Such as Figure 10 As shown, this embodiment provides a fan-out routing structure, which has a third fan-out routing 300, wherein one end of the fan-out routing is connected to a bonding terminal (bonding pad) 10 of a driving circuit board, and the other end of the fan-out routing Connect to the access terminal 20 of the TFT array area. The first fan-out routing 100 includes a first routing 1, a second routing 2 and a third routing 3, the second routing 2 is arranged above the first routing 1 and partially overlaps the first routing 1, The third routing 3 is disposed above the first routing 1 and partially overlaps the first routing 1 .
[0076] Such as Figure 11 As shown, when the third wiring 3 is arranged above the first wiring 1 and partially overlaps with the first wiring 1, the first fan-out wiring 100 also includes a third substrate 310, a third insulating layer 320, a third The passivation layer 330 and the sixth passivation layer 340 .
[0077] The third s...
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