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A resin-type no-cleaning flux paste

A solder paste and no-cleaning technology, which is applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve problems such as environmental pollution, affecting the reliability of electronic devices, and corrosion of components around solder joints, so as to improve welding Effect of quality, good aging resistance, good solderability

Active Publication Date: 2021-07-30
北京瑞投安信科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Usually the solder paste contains a certain amount of rosin, and the rosin will leave a residue after soldering. The residue has a certain acidity. If it is affected by temperature or humidity, it will corrode the components around the solder joint, thus affecting the reliability of electronic devices. sex
If a cleaning agent is used to clean the residue, it will pollute the environment. Therefore, it is urgent to provide a solder paste with simple production method, environmental friendliness and high reliability.

Method used

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  • A resin-type no-cleaning flux paste
  • A resin-type no-cleaning flux paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment 1 A kind of resin type no-clean soldering flux paste

[0037] A resin-type no-cleaning flux paste provided in this embodiment is composed of the following raw materials in percentage by weight: 20% of C5 hydrogenated petroleum resin, 5% of DCPD resin, 5% of terpene resin P-125, methyl Hydroquinone 1%, Succinic Acid 4%, Adipic Acid 8%, Modified Hydrogenated Castor Oil 8%, Diethylene Glycol Hexyl Ether 29% and 2-Ethyl-1,3-Hexanediol 20% .

[0038] The preparation method of above-mentioned flux paste comprises the following steps:

[0039] Mix C5 hydrogenated petroleum resin, DCPD resin, terpene resin P-125, diethylene glycol hexyl ether and 2-ethyl-1,3-hexanediol, stir at 140°C for 30min, then add methyl Hydroquinone, succinic acid, adipic acid and modified hydrogenated castor oil were stirred for 20 minutes, and then cooled to room temperature under stirring conditions.

Embodiment 2

[0040] Embodiment 2 A kind of resin type no-clean soldering flux paste

[0041] A resin-type no-clean soldering flux paste provided in this embodiment is composed of the following raw materials in percentage by weight: C9 hydrogenated petroleum resin 15%, terpene resin P-105 5%, terpene resin P-115 20% %, methyl hydroquinone 3%, phenylsuccinic acid 5%, fatty polyamide 5%, tripropylene glycol butyl ether 35% and 2-ethyl-1,3-hexanediol 12%.

[0042] The preparation method of above-mentioned flux paste comprises the following steps:

[0043]Mix C9 hydrogenated petroleum resin, terpene resin P-105, terpene resin P-115, tripropylene glycol butyl ether and 2-ethyl-1,3-hexanediol, stir at 120°C for 40min, then add in sequence Methyl hydroquinone, phenylsuccinic acid and fatty polyamide, stirred for 30min, then cooled to room temperature while stirring.

Embodiment 3

[0044] Embodiment 3 A kind of resin type no-clean soldering flux paste

[0045] A resin-type no-clean flux paste provided in this embodiment is composed of the following raw materials in weight percentage: 2% of C5 / C9 copolymer resin, 3% of DCPD resin, 15% of terpene resin P-105, p-hydroxy Benzoic acid 4%, malic acid 4%, adipic acid 5%, modified hydrogenated castor oil 4%, fatty polyamide 8% and diethylene glycol hexyl ether 55%.

[0046] The preparation method of above-mentioned flux paste comprises the following steps:

[0047] Mix C5 / C9 copolymer resin, DCPD resin, terpene resin P-105, and diethylene glycol hexyl ether, stir at 150°C for 30 minutes, then add p-hydroxybenzoic acid, malic acid, adipic acid, modified Hydrogenated castor oil and fatty polyamide, stirred for 20min, then cooled to room temperature while stirring.

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Abstract

The invention discloses a resin-type free-cleaning solder paste, which belongs to the field of electronic product packaging. The raw material components of the treatment agent mainly include petroleum resin, terpene resin, antioxidant, active agent, thixotropic agent and solvent. The preparation method includes adding petroleum resin and terpene resin into a solvent to dissolve, then adding antioxidant, active agent and thixotropic agent in sequence for stirring and dissolving, and then cooling to room temperature under stirring condition. The mixture of petroleum resin and terpene resin is used in the raw material, which has a good film-forming effect, and has a better protective effect on the solder powder during the welding process, which can reduce the secondary oxidation of the solder powder and improve the welding quality. Moreover, petroleum resin and terpene resin have no chemical activity, and the residue after welding is non-corrosive, and high reliability can be achieved without cleaning.

Description

technical field [0001] The invention belongs to the field of packaging of electronic products, and in particular relates to a resin type no-cleaning soldering paste. Background technique [0002] With the rapid development of electronic products, people are increasingly pursuing lighter, more environmentally friendly and higher-performance electronic consumer products. As a welding material between electronic components and circuit boards, solder paste is widely used in the production of electronic products due to its high production efficiency, high welding strength and simple process preparation. Traditional solder paste is mainly composed of about 85-90% tin-lead solder powder and about 10-15% solder paste. Traditional solder paste usually contains halogen materials, which have high-efficiency activation performance and surface purification effect, and can protect the solder from oxidation during soldering, but there will be residues on the surface of the circuit board a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/36B23K35/362B23K35/363
CPCB23K35/36B23K35/3613B23K35/362
Inventor 肖山
Owner 北京瑞投安信科技有限公司
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