Heat dissipation device of outdoor breathable integrated base station case
A heat-dissipating device and air-permeable technology, applied in electrical components, structural parts of electrical equipment, cooling/ventilation/heating renovation, etc., can solve problems such as poor heat dissipation capacity
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Embodiment 1
[0022] refer to Figure 1-5 , an outdoor air-permeable integrated base station case cooling device, comprising a base plate 1, a base station case body 3 is arranged above the base plate 1, a fixing plate 9 is vertically welded on the upper surface of the base plate 1 on one side of the base station case body 3, and fixed The board 9 and the base station chassis body 3 are parallel to each other. The four corners of the lower surface of the base station chassis body 3 are welded with support legs 2 vertically. The bottom ends of the four support legs 2 are vertically fixed on the upper surface of the base plate 1 together. Raise the position of the base station chassis body 3 so that there is a certain distance between the base station chassis body 3 and the base plate 1, increase the contact area between the outside of the base station chassis body 3 and the air, and increase the heat dissipation effect of the base station chassis body 3 itself.
[0023] An underground box 4 ...
Embodiment 2
[0027] refer to Figure 1-5 As another preferred embodiment of the present invention, the difference from Embodiment 1 is that the refrigeration mechanism includes a refrigeration box 15, which is welded and fixed on the side of the fixing plate 9 away from the base station chassis body 3, and on the top wall of the refrigeration box 15 Equidistant and run through are provided with air inlet holes 16, the side of the refrigeration box 15 away from the fixed plate 9 is equidistantly inlaid and fixed with semiconductor refrigeration sheets 17, the second air guide pipe 14 is communicated and fixed on the bottom wall of the refrigeration box 15, and the refrigeration box 15 around the fixed plate 9 equidistant and communicated with cooling holes. During actual installation, the cooling surface of the semiconductor cooling chip 17 faces the inside of the cooling box 15 .
[0028] Under the action of the semiconductor refrigeration sheet 17, the air in the refrigeration box 15 is ...
Embodiment 3
[0030] refer to Figure 1-5 , as another preferred embodiment of the present invention, the difference from Embodiment 1 is that the top of the fixed plate 9 is vertically welded with a shielding top plate 10, the shielding top plate 10 and the bottom plate 1 are parallel to each other, and the underground box 4 is arranged on the fixed plate 9 and Between the shielding top boards 10, a cavity 18 is provided inside the shielding top board 10, holes 19 are equidistantly provided on the lower surface of the shielding top board 10, and the holes 19 and the cavities 18 are connected, and the upper surface of the shielding top board 10 is equidistant and vertically fixed A first pipeline 20 is provided, the bottom end of the first pipeline 20 communicates with the cavity 18 , and the top end of the first pipeline 20 is vertically connected and fixedly provided with a second pipeline 21 .
[0031] The shielding top plate 10 can block the sunlight for the base station cabinet body 3,...
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